# US 12,217,916 B2 · Electronic component and method for manufacturing electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,916 B2 - Document ID: US12217916B2 - Status: Granted - Kind: B2 - Application number: 18/065,917 - Filed: 2022-12-14 - Published: 2023-04-20 - Granted: 2025-02-04 - Earliest claimed: 2020-06-16 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yasuhiro Tamatani; Kazuya Kusuda - Web page: https://patentgrep.com/patent/US12217916B2 ## CPC - H01G 9/012: specially adapted for solid capacitors - H01F 27/29: Terminals; Tapping arrangements {for signal inductances} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 9/0029: {Processes of manufacture} - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract An electronic component including a base body including a first end surface and a second end surface opposite to each other in a length direction, a first internal electrode exposed at the first end surface, and a second internal electrode exposed at the second end surface; a first external electrode on the first end surface and connected to the first internal electrode; and a second external electrode on the second end surface and connected to the second internal electrode. The first external electrode includes a resin electrode layer containing a conductive component and a resin component, the resin electrode layer of the first external electrode includes a first portion facing a whole surface of the first end surface of the base body, and a plurality of protrusions are arranged periodically side by side on a surface of the first portion of the resin electrode layer of the first external electrode. ## Claims ### Claim 1 An electronic component comprising: a base body which includes a first end surface and a second end surface opposite to each other in a length direction, a first main surface and a second main surface opposite to each other in a thickness direction perpendicular to the length direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular to the length direction and the thickness direction, a first internal electrode exposed at the first end surface, and a second internal electrode exposed at the second surface; a first external electrode on the first end surface and connected to the first internal electrode; and a second external electrode on the second end surface and connected to the second internal electrode, wherein the first external electrode includes a first resin electrode layer containing a conductive component and a resin component, the first resin electrode layer of the first external electrode includes a first portion facing a whole surface of the first end surface of the base body, a first plurality of protrusions are arranged periodically side by side on a surface of the first portion of the first resin electrode layer of the first external electrode, the surface of the first portion being opposite to the first end surface of the base body, and wherein when viewing a cross section along the length direction and the thickness direction, in the first external electrode, a surface of the first portion of the first resin electrode layer has an arithmetic mean roughness Ra defined by JIS B 0601:2013 of 20 μm to 100 μm. ### Claim 2 (depends on 1) The electronic component according to claim 1, wherein the first external electrode further includes an outer plating layer along surfaces of the first plurality of protrusions of the first portion of the first resin electrode layer. ### Claim 3 (depends on 1) The electronic component according to claim 1, wherein the first resin electrode layer of the first external electrode further includes a third portion that extends from the first portion so as to face a part of at least one surface selected from the group consisting of the first main surface, the second main surface, the first side surface, and the second side surface of the base body, and the first plurality of protrusions of the first external electrode are not provided on a surface of the third portion of the first resin electrode layer of the first external electrode, the surface of the third portion being opposite to the base body. ### Claim 4 (depends on 1) The electronic component according to claim 1, wherein the second external electrode includes a second resin electrode layer containing a conductive component and a resin component, the second resin electrode layer of the second external electrode includes a second portion facing a whole surface of the second end surface of the base body, and a second plurality of protrusions are arranged periodically side by side on a surface of the second portion of the second resin electrode layer of the second external electrode, the surface of the second portion being opposite to the second end surface of the base body. ### Claim 5 (depends on 4) The electronic component according to claim 4, wherein the second external electrode further includes an outer plating layer along surfaces of the plurality of protrusions of the second portion of the second resin electrode layer. ### Claim 6 (depends on 4) The electronic component according to claim 4, wherein the second resin electrode layer of the second external electrode further includes a fourth portion that extends from the second portion so as to face a part of at least one surface selected from the group consisting of the first main surface, the second main surface, the first side surface, and the second side surface of the base body, and the second plurality of protrusions of the second external electrode are not provided on a surface of the fourth portion of the second resin electrode layer of the second external electrode, the surface of the fourth portion being opposite to the base body. ### Claim 7 (depends on 1) The electronic component according to claim 1, wherein the base body is formed of a resin molding including an electrolytic capacitor element, and a sealing resin sealing a periphery of the electrolytic capacitor element, the electrolytic capacitor element includes an anode, a dielectric layer on a surface of the anode, and a cathode facing the anode via the dielectric layer and including an electrolyte layer, and the first internal electrode is one of the anode or the cathode. ### Claim 8 (depends on 1) The electronic component according to claim 1, wherein the base body is a stack including at least one ceramic layer selected from the group consisting of a dielectric ceramic layer, a magnetic ceramic layer, a piezoelectric ceramic layer, and a semiconductor ceramic layer, the first internal electrode layer and the second internal electrode layer. ### Claim 9 An electronic component comprising: a base body which includes a first end surface and a second end surface opposite to each other in a length direction, a first main surface and a second main surface opposite to each other in a thickness direction perpendicular to the length direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular to the length direction and the thickness direction, a first internal electrode exposed at the first end surface, and a second internal electrode exposed at the second surface; a first external electrode on the first end surface and connected to the first internal electrode; and a second external electrode on the second end surface and connected to the second internal electrode, wherein the first external electrode includes a first resin electrode layer containing a conductive component and a resin component, the first resin electrode layer of the first external electrode includes a first portion facing a whole surface of the first end surface of the base body, and a first plurality of protrusions are arranged periodically side by side on a surface of the first portion of the first resin electrode layer of the first external electrode, the surface of the first portion being opposite to the first end surface of the base body, and wherein when viewing a cross section along the length direction and the thickness direction, in the first external electrode, bottom surfaces located in respective gaps between the first plurality of protrusions and top surfaces of the first plurality of protrusions are present on a surface of the first portion of the first resin electrode layer. ### Claim 10 (depends on 9) The electronic component according to claim 9, wherein a length in the thickness direction of the bottom surface is 50 μm to 200 μm. ### Claim 11 (depends on 9) The electronic component according to claim 9, wherein a shortest distance in the thickness direction between the top surfaces of two adjacent protrusions of the first plurality of protrusions is 50 μm to 100 μm. ### Claim 12 (depends on 9) The electronic component according to claim 9, wherein a shortest distance in the thickness direction between the top surfaces of two adjacent protrusions of the first plurality of protrusions is larger than a length in the thickness direction of the bottom surface. ### Claim 13 (depends on 9) The electronic component according to claim 9, wherein a length in the thickness direction of the top surface is 10 μm to 100 μm. ### Claim 14 (depends on 9) The electronic component according to claim 9, wherein a length in the thickness direction of the bottom surface is larger than a length in the thickness direction of the top surface. ### Claim 15 A method of producing an electronic component, the method comprising: forming a base body which includes a first end surface and a second end surface opposite to each other in a length direction, a first main surface and a second main surface opposite to each other in a thickness direction perpendicular to the length direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular to the length direction and the thickness direction, a first internal electrode exposed at the first end surface, and a second internal electrode exposed at the second end surface; forming, on the first end surface of the base body, a first external electrode so as to be connected to the first internal electrode by applying a conductive paste containing a conductive component and a resin component by screen printing to form a first resin electrode layer including a first portion facing a whole surface of the first end surface of the base body so that a first plurality of protrusions are arranged periodically side by side on a surface of the first portion, the surface of the first portion being opposite to the first end surface of the base body; and forming, on the second end surface of the base body, a second external electrode so as to be connected to the second internal electrode. ### Claim 16 (depends on 15) The method of producing an electronic component according to claim 15, wherein the second external electrode is formed by applying a conductive paste containing a conductive component and a resin component by screen printing to form a second resin electrode layer including a second portion facing a whole surface of the second end surface of the base body so that a second plurality of protrusions are arranged periodically side by side on a surface of the second portion, the surface of the second portion being opposite to the second end surface of the base body. ### Claim 17 (depends on 15) The method of producing an electronic component according to claim 15, wherein the conductive paste has a thixotropic index of 1.5 to 10.0. ### Claim 18 (depends on 15) The method of producing an electronic component according to claim 15, wherein the conductive paste has a viscosity of 25 Pa·s to 400 Pa·s.