# US 12,217,899 B2 · Apparatus and power module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,899 B2 - Document ID: US12217899B2 - Status: Granted - Kind: B2 - Application number: 18/389,120 - Filed: 2023-11-13 - Published: 2024-03-21 - Granted: 2025-02-04 - Earliest claimed: 2018-10-09 - Assignees: Delta Electronics, Inc. - Applicants: Delta Electronics, Inc. - Inventors: Yahong Xiong; Da Jin; Qinghua Su - Web page: https://patentgrep.com/patent/US12217899B2 ## CPC - H01F 27/2804: {Printed windings} - G05F 1/575: characterised by the feedback circuit - G06F 1/183: Internal mounting support structures, e.g. for supporting printed circuit boards - H01F 17/04: with magnetic core - H01F 17/06: with core substantially closed in itself, e.g. toroid - H01F 27/02: Casings - H01F 27/24: Magnetic cores - H01F 27/292: {Surface mounted devices} - H01R 12/52: connecting to other rigid printed circuits or like structures - H01R 12/58: terminals for insertion into holes - H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 3/1584: {with a plurality of power processing stages connected in parallel} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - H05K 1/165: {incorporating printed inductors} - H05K 1/181: associated with surface mounted components - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 7/1427: {Housings} - H05K 7/2089: {for power electronics, e.g. for inverters for controlling motor} - H10W 90/00: Package configurations - H01F 2017/067: {Core with two or more holes to lead through conductor} - H05K 2201/10015: Non-printed capacitor - H05K 2201/1003: Non-printed inductor - H05K 2201/10053: Switch - H05K 2201/10166: Transistor - H05K 2201/10522: Adjacent components - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - G05F: SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load. ## Claims ### Claim 1 An apparatus, comprising: a first circuit board assembly, comprising a first printed circuit board and at least one power circuit, wherein the first printed circuit board has a first surface and a second surface opposite to each other, and the at least one switch circuit is disposed on the first printed circuit board; a magnetic core assembly, being adjacent to the first printed circuit board, and comprising a magnetic core portion and at least one first electrical conductor, wherein the at least one first electrical conductor is penetrated through the magnetic core portion; and a second electrical conductor, at least one third electrical conductor and a signal communication part conductor, being around the magnetic core portion together. ### Claim 2 (depends on 1) The apparatus according to claim 1, further comprising: a second circuit board assembly comprising a second printed circuit board, the second printed circuit board having a first surface and a second surface opposite to each other; wherein the second electrical conductor, the at least one third electrical conductor, the signal communication part conductor and the magnetic core assembly are located between the first circuit board assembly and the second circuit board assembly. ### Claim 3 (depends on 2) The apparatus according to claim 2, wherein the second circuit board assembly further comprises a plurality of pads and a plurality of conductive parts, the plurality of pads are disposed on the second surface of the second printed circuit board to form a first pattern, the plurality of conductive parts are disposed on the first surface of the second printed circuit board to form a second pattern, and the plurality of pads are electrically connected with the plurality of conductive parts through the second printed circuit board. ### Claim 4 (depends on 3) The apparatus according to claim 3, wherein the first pattern is different from the second pattern. ### Claim 5 (depends on 2) The apparatus according to claim 2, wherein the apparatus is used to provide power to an electronic device through a system board, and the apparatus and the electronic device are located at opposite sides of the system board. ### Claim 6 (depends on 5) The apparatus according to claim 5, wherein the second circuit board assembly further comprises at least one output capacitor disposed on the second surface of the second printed circuit board or embedded within the second printed circuit board, wherein a vertical projection of the at least one output capacitor on the system board at least partially overlaps with a vertical projection of the electronic device on the system board. ### Claim 7 (depends on 1) The apparatus according to claim 1, wherein the magnetic core assembly is an inductor. ### Claim 8 (depends on 1) The apparatus according to claim 1, wherein the apparatus further comprises at least one input capacitor, wherein the input capacitor is disposed on the first surface of the first printed circuit board. ### Claim 9 A power module, comprising: a magnetic core assembly, comprising a magnetic core portion and at least one first electrical conductor; and a second electrical conductor, at least one third electrical conductor and a signal communication part conductor, being around the magnetic core together, each of the at least one first electrical conductor, the second electrical conductor, the at least one third electrical conductor and the signal communication part conductor has a first terminal and a second terminal, the first terminals of the at least one first electrical conductor, the second electrical conductor, the at least one third electrical conductor and the signal communication part conductor forming a first surface of the power module together, the second terminals of the at least one first electrical conductor, the second electrical conductor, the at least one third electrical conductor and the signal communication part conductor forming a second surface of the power module together, wherein the first surface and the second surface is used for soldering. ### Claim 10 (depends on 9) The power module according to claim 9, wherein the power module is a self-contained unit. ### Claim 11 (depends on 9) The power module according to claim 9, wherein the power module is soldered to a first printed circuit board through the first surface of the power module to realize electrical connection between the power module and the first printed circuit board, and the power module is soldered to a second printed circuit board through the second surface of the power module to realize electrical connection between the power module and the second printed circuit board. ### Claim 12 (depends on 11) The power module according to claim 11, wherein each of the second electrical conductor and the at least one third electrical conductors comprises a bump, the second printed circuit board comprises a second soldering pad and at least one third soldering pad, the bump of the second electrical conductor is used as the second terminal of the second electrical conductor and the bump of the at least one third electrical conductor is used as the second terminal of the at least one third electrical conductor, the bump of the second electrical conductor is soldered on the second soldering pad and the bump of the at least one third conductor is soldered on the corresponding third soldering pad so as to form a plurality of receiving spaces between the bumps.