# US 12,217,896 B2 · Coil component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,896 B2 - Document ID: US12217896B2 - Status: Granted - Kind: B2 - Application number: 17/116,091 - Filed: 2020-12-09 - Published: 2022-01-20 - Granted: 2025-02-04 - Earliest claimed: 2020-07-15 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Chan Yoon; Dong Hwan Lee; Dong Jin Lee; Sang Soo Park - Web page: https://patentgrep.com/patent/US12217896B2 ## CPC - H01F 27/2804: {Printed windings} - H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)} - H01F 17/04: with magnetic core - H01F 27/255: made from particles (H01F27/26 takes precedence) - H01F 27/29: Terminals; Tapping arrangements {for signal inductances} - H01F 27/292: {Surface mounted devices} - H01F 27/32: Insulating of coils, windings, or parts thereof - H01F 27/324: {Insulation between coil and core, between different winding sections, around the coil; Other insulation structures} - H01F 41/041: {Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00)} - H01F 41/12: Insulating of windings ({impregnating or encapsulating of transformers H01F41/005} ; of conductors in general H01B13/06) - H01F 2017/0046: {with a conductive path having a bridge} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A coil component includes a body, a planar spiral-shaped coil portion disposed in the body, a lead portion disposed to be spaced apart from the coil portion in the body, a support substrate disposed between the coil portion and the lead portion to correspond to the lead portion, a via penetrating through the support substrate to connect an internal end portion of the coil portion and an internal end portion of the lead portion to each other, an insulating layer covering the coil portion and the lead portion, and a first external electrode and a second external electrode disposed to be spaced apart from each other on a surface of the body and connected to the external end portion of each of the coil portion and the lead portion. ## Claims ### Claim 1 A coil component, comprising: a body; a planar spiral-shaped coil portion disposed in the body, the coil portion having a core penetrating through a center thereof; a conducting lead portion disposed to be spaced apart from the coil portion in the body without overlapping the core; an insulating support substrate disposed between the coil portion and the lead portion, and overlapping the coil portion only in a region where the coil portion and the lead portion overlap; a via penetrating through the support substrate to connect an internal end portion of the coil portion and an internal end portion of the lead portion to each other; an insulating layer covering the coil portion and the lead portion; and a first external electrode disposed on a side surface of the body and connected to an external side surface of the lead portion. ### Claim 2 (depends on 1) The coil component of claim 1, wherein the lead portion has a thickness less than a thickness of the coil portion. ### Claim 3 (depends on 1) The coil component of claim 1, wherein the coil portion comprises a seed layer and a plating layer disposed on the seed layer. ### Claim 4 (depends on 3) The coil component of claim 3, wherein the plating layer does not cover a side surface of the seed layer, and the insulating layer is in contact with the side surface of the seed layer. ### Claim 5 (depends on 3) The coil component of claim 3, wherein the plating layer covers at least a portion of a side surface of the seed layer. ### Claim 6 (depends on 5) The coil component of claim 5, wherein the side surface of the seed layer is not in contact with the insulating layer. ### Claim 7 (depends on 3) The coil component of claim 3, wherein the seed layer comprises a first seed pattern layer and a second seed pattern layer disposed on the first seed pattern layer to expose a side surface of the first seed pattern layer, and the plating layer is in contact with a side surface of each of the first and second seed pattern layers. ### Claim 8 (depends on 7) The coil component of claim 7, wherein the plating layer is an isotropic plating layer. ### Claim 9 (depends on 7) The coil component of claim 7, wherein in a cross section of the body in a thickness direction, the plating layer grown from an upper surface of the seed layer in a thickness direction of the body has a thickness greater than a thickness of the plating layer grown from a side surface of the seed layer in a direction, perpendicular to the thickness of the body. ### Claim 10 (depends on 1) The coil component of claim 1, wherein the support substrate includes a glass fiber. ### Claim 11 A coil component comprising: a body; a planar spiral-shaped coil portion disposed in the body having a core penetrating through a center of the coil portion; a lead portion disposed on a first surface of the coil portion in the body without overlapping the core; a support substrate disposed to overlap the coil portion in only an overlapping region between the lead portion and the first surface of the coil portion; and a via penetrating through the support substrate to connect the coil portion and the lead portion to each other, wherein an outer perimeter of the lead portion is congruent with an outer perimeter of the support substrate when viewed in an axis direction of the coil portion. ### Claim 12 A coil component, comprising: a coil having a first end and a second end, the coil being disposed in a body such that the first end is exposed from a first surface of the body and the second end is spaced apart from a second surface of the body by a distance of at least a width of one turn of the coil, the second surface opposing the first surface in a length direction; a core penetrating a central portion of the coil; a conducting lead portion having a first end disposed on the second end of the coil and a second end exposed from the second surface of the body, the lead portion extending over the distance; an insulating support substrate disposed between the lead portion and overlapping the coil portion, the insulating substrate overlapping the coil portion only in a region where the coil portion and the lead portion overlap; and a conducting via penetrating the support substrate and connecting the first end of the lead portion and the second end of the coil to each other, wherein an outer perimeter of the lead portion is congruent with an outer perimeter of the support substrate when viewed in an axis direction of the coil portion. ### Claim 13 (depends on 12) The coil component of claim 12, further comprising: a first external electrode disposed on the first surface of the body and contacting the first end of the coil; and a second external electrode disposed on the second surface of the body and contacting the second end of the lead portion. ### Claim 14 (depends on 12) The coil component of claim 12, wherein a thickness of the coil is greater than a thickness of the lead portion. ### Claim 15 (depends on 12) The coil component of claim 12, further comprising an insulating layer covering the lead portion and a portion of the coil not in contact with the support substrate. ### Claim 16 (depends on 12) The coil component of claim 12, wherein the coil comprises a seed layer and a plating layer disposed on the seed layer, the plating layer having a thickness greater than the seed layer. ### Claim 17 (depends on 16) The coil component of claim 16, wherein a portion of the seed layer is disposed on the support substrate. ### Claim 18 (depends on 16) The coil component of claim 16, wherein the plating layer covers at least a portion of a side surface of the seed layer. ### Claim 19 (depends on 12) The coil component of claim 12, wherein the support substrate has a same shape as that of the lead portion.