# US 12,217,637 B2 · Display backplane and preparation method therefor, and display apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,637 B2 - Document ID: US12217637B2 - Status: Granted - Kind: B2 - Application number: 17/791,226 - Filed: 2021-08-27 - Published: 2024-05-30 - Granted: 2025-02-04 - Earliest claimed: 2021-08-27 - Assignees: Boe Technology Group Co., Ltd. - Applicants: BOE Technology Group Co., Ltd. - Inventors: Yang Yue; Wei Wang; Ruoyu Ma; Shunhang Zhang; Chuanxiang Xu; Xiang Li; Yong Yu; Shi Shu; Qi Yao - Web page: https://patentgrep.com/patent/US12217637B2 ## CPC - G09F 9/33: being semiconductor devices, e.g. diodes - H10D 86/00: Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates - H10H 29/10: Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 (active-matrix LED displays H10H29/30) - H10W 90/00: Package configurations - H10H 20/852: Encapsulations - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure provides a display backplane and a preparation method therefor, and a display apparatus. The display backplane includes a plurality of display units, at least one display unit includes a pixel area and a light transmitting area, the pixel area is configured to perform image display and the light transmitting area is configured to transmit light; and in a plane perpendicular to the display backplane, the light transmitting area includes a substrate and a light transmitting structure layer arranged on the substrate, and the light transmitting structure layer is provided with light transmitting holes. ## Claims ### Claim 1 A display backplane, comprising a plurality of display units, wherein: at least one display unit comprises a pixel area and a light transmitting area, the pixel area is configured to perform image display and the light transmitting area is configured to transmit light; in a direction perpendicular to the display backplane, the light transmitting area comprises a substrate and a light transmitting structure layer arranged on the substrate, and the light transmitting structure layer is provided with light transmitting holes; the light transmitting structure layer comprises: a buffer layer arranged on the substrate, a first passivation layer arranged on a side of the buffer layer away from the substrate, a first planarization layer arranged on a side of the first passivation layer away from the substrate, a second planarization layer arranged on a side of the first planarization layer away from the substrate, a second passivation layer arranged on a side of the second planarization layer away from the substrate, a third passivation layer arranged on a side of the second passivation layer away from the substrate, and a third planarization layer arranged on a side of the third passivation layer away from the substrate; and the light transmitting holes provided on the light transmitting structure layer comprise any one or more of: a through hole penetrating the buffer layer, a through hole penetrating the first passivation layer, a through hole penetrating the first planarization layer, a through hole penetrating the second planarization layer, a through hole penetrating the second passivation layer, a through hole penetrating the third passivation layer, and a through hole penetrating the third planarization layer; and the second passivation layer comprises a first passivation sublayer and a second passivation sublayer, the second passivation sublayer is arranged on a side of the first passivation sublayer away from the substrate, a material of the first passivation sublayer comprises silicon nitride, and a material of the second passivation sublayer comprises loose silicon nitride. ### Claim 2 (depends on 1) The display backplane according to claim 1, wherein the light transmitting structure layer comprises an inorganic material layer and an organic material layer, and the light transmitting holes provided on the light transmitting structure layer comprise any one or more of: a through hole penetrating the inorganic material layer and a through hole penetrating the organic material layer. ### Claim 3 (depends on 2) The display backplane according to claim 2, wherein the display backplane comprises a display area and a bonding area located on at least one side of the display area, the plurality of display units are located in the display area; in the direction perpendicular to the display backplane, the pixel area comprises the substrate and a pixel structure layer arranged on the substrate, the bonding area comprises the substrate and a bonding structure layer arranged on the substrate, the pixel structure layer and the bonding structure layer each comprise an inorganic material layer, a conductive layer and an organic material layer, and a thickness of the organic material layer in the bonding structure layer is smaller than a thickness of the organic material layer in the pixel structure layer. ### Claim 4 (depends on 1) The display backplane according to claim 1, wherein the light transmitting area further comprises a protective layer arranged on a side of the light transmitting structure layer away from the substrate, and the light transmitting holes are filled by the protective layer. ### Claim 5 (depends on 4) The display backplane according to claim 4, wherein the light transmitting area further comprises an antireflection layer arranged on a side of the protective layer away from the substrate. ### Claim 6 (depends on 5) The display backplane according to claim 5, wherein a material of the antireflection layer comprises magnesium fluoride. ### Claim 7 (depends on 5) The display backplane according to claim 5, wherein a thickness of the antireflection layer is 50 nm to 500 nm. ### Claim 8 (depends on 5) The display backplane according to claim 5, wherein the display backplane comprises a display area and a bonding area located on at least one side of the display area, the plurality of display units are located in the display area; in the direction perpendicular to the display backplane, the pixel area comprises the substrate and a pixel structure layer arranged on the substrate, the bonding area comprises the substrate and a bonding structure layer arranged on the substrate, the pixel structure layer and the bonding structure layer each comprise an inorganic material layer, a conductive layer and an organic material layer, and a thickness of the organic material layer in the bonding structure layer is smaller than a thickness of the organic material layer in the pixel structure layer. ### Claim 9 (depends on 4) The display backplane according to claim 4, wherein the display backplane comprises a display area and a bonding area located on at least one side of the display area, the plurality of display units are located in the display area; in the direction perpendicular to the display backplane, the pixel area comprises the substrate and a pixel structure layer arranged on the substrate, the bonding area comprises the substrate and a bonding structure layer arranged on the substrate, the pixel structure layer and the bonding structure layer each comprise an inorganic material layer, a conductive layer and an organic material layer, and a thickness of the organic material layer in the bonding structure layer is smaller than a thickness of the organic material layer in the pixel structure layer. ### Claim 10 (depends on 1) The display backplane according to claim 1, wherein the light transmitting area further comprises an antireflection layer arranged on a side of the substrate away from the light transmitting structure layer. ### Claim 11 (depends on 1) The display backplane according to claim 1, wherein the display backplane comprises a display area and a bonding area located on at least one side of the display area, the plurality of display units are located in the display area; in the direction perpendicular to the display backplane, the pixel area comprises the substrate and a pixel structure layer arranged on the substrate, the bonding area comprises the substrate and a bonding structure layer arranged on the substrate, the pixel structure layer and the bonding structure layer each comprise an inorganic material layer, a conductive layer and an organic material layer, and a thickness of the organic material layer in the bonding structure layer is smaller than a thickness of the organic material layer in the pixel structure layer. ### Claim 12 (depends on 11) The display backplane according to claim 11, wherein the pixel structure layer at least comprises: a buffer layer arranged on the substrate, a first conductive layer arranged on a side of the buffer layer away from the substrate and comprising a first electrode and a second electrode, a first passivation layer arranged on a side of the first conductive layer away from the substrate, a first planarization layer arranged on a side of the first passivation layer away from the substrate, a second planarization layer arranged on a side of the first planarization layer away from the substrate, a second passivation layer arranged on a side of the second planarization layer away from the substrate, and a second conductive layer arranged on a side of the second passivation layer away from the substrate and comprising a positive connection terminal and a negative connection terminal; and the bonding structure layer at least comprises: a buffer layer arranged on the substrate, a first conductive layer arranged on a side of the buffer layer away from the substrate and comprising a first bonding electrode and a second bonding electrode, a first passivation layer arranged on a side of the first conductive layer away from the substrate, a first planarization layer arranged on a side of the first passivation layer away from the substrate, a second passivation layer arranged on a side of the first planarization layer away from the substrate, and a second conductive layer arranged on a side of the second passivation layer away from the substrate and comprising a first bonding terminal and a second bonding terminal. ### Claim 13 (depends on 1) A display apparatus, comprising the display backplane according to claim 1. ### Claim 14 A method for preparing a display backplane, the display backplane comprising a plurality of display units, at least one display unit comprising a pixel area and a light transmitting area, the pixel area being configured to perform image display and the light transmitting area being configured to transmit light; the method comprising: forming a light transmitting structure layer on a substrate of the light transmitting area, the light transmitting structure layer being provided with light transmitting holes, wherein forming the light transmitting structure layer on the substrate of the light transmitting area comprises: forming a buffer layer on the substrate, forming a first passivation layer on the buffer layer, forming a first planarization layer on the first passivation layer, forming a second planarization layer on the first planarization layer, forming a second passivation layer on the second planarization layer, forming a third passivation layer on the second passivation layer, and forming a third planarization layer on the third passivation layer; wherein the light transmitting holes provided on the light transmitting structure layer comprise any one or more of: a through hole penetrating the buffer layer, a through hole penetrating the first passivation layer, a through hole penetrating the first planarization layer, a through hole penetrating the second planarization layer, a through hole penetrating the second passivation layer, a through hole penetrating the third passivation layer, and a through hole penetrating the third planarization layer; and wherein the second passivation layer comprises a first passivation sublayer and a second passivation sublayer, the second passivation sublayer is arranged on a side of the first passivation sublayer away from the substrate, a material of the first passivation sublayer comprises silicon nitride, and a material of the second passivation sublayer comprises loose silicon nitride. ### Claim 15 (depends on 14) The method according to claim 14, wherein forming the light transmitting structure layer on the substrate of the light transmitting area comprises: forming the light transmitting structure layer comprising an inorganic material layer and an organic material layer on the substrate of the light transmitting area; and the light transmitting holes provided on the light transmitting structure layer comprise any one or more of: a through hole penetrating the inorganic material layer and a through hole penetrating the organic material layer.