# US 12,217,112 B2 · IC card and method for manufacturing IC card > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,112 B2 - Document ID: US12217112B2 - Status: Granted - Kind: B2 - Application number: 18/134,959 - Filed: 2023-04-14 - Published: 2023-08-17 - Granted: 2025-02-04 - Earliest claimed: 2020-10-22 - Assignees: Toppan Inc. - Applicants: Toppan Inc. - Inventors: Yukiko Katano; Tetsuya Tsukada; Shin Kataoka - Web page: https://patentgrep.com/patent/US12217112B2 ## CPC - G06K 19/0718: {the sensor being of the biometric kind, e.g. fingerprint sensors (fingerprint sensors in general G06V40/13; biometric access-control systems in general, see G07C9/00)} - G06K 19/07354: {by biometrically sensitive means, e.g. fingerprint sensitive (fingerprint sensors in general G06V40/12; biometrically activated access control G07C9/25)} - B42D 25/23: Identity cards - B42D 25/305: Associated digital information (record carriers for use with machines and with at least a part designed to carry digital markings G06K19/00) - G06K 19/07769: {the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface} - G06K 19/07707: {the visual interface being a display, e.g. LCD or electronic ink} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - B42D: BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS ## Abstract An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC card including an ultrasonic fingerprint sensor connected to the IC chip and a storage unit in which fingerprint data for matching is stored. An outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin. ## Claims ### Claim 1 An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC chip comprising: an ultrasonic fingerprint sensor connected to the IC chip; and a storage unit in which fingerprint data for matching is stored; wherein an outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin, wherein the IC card comprises: a flexible substrate comprising a polyimide base material; a conductor layer on the flexible substrate, the IC chip, the storage unit and the fingerprint sensor are patterned in said conductor layer; a resin frame on the flexible substrate, the resin frame having an opening that exposes the IC chip, the storage unit and the fingerprint sensor; and a cured resin layer in the opening of the resin frame, the cured resin layer sealing the IC chip, the storage unit and the fingerprint sensor. ### Claim 2 (depends on 1) The IC card of claim 1, further comprising a terminal connected to the IC chip and exposed on the outer surface, wherein the IC card is configured to enable contact communication. ### Claim 3 (depends on 1) The IC card of claim 1, further comprising a loop antenna connected to the IC chip, wherein the IC card is configured to enable contactless communication. ### Claim 4 (depends on 1) The IC card of claim 1, further comprising a power storage unit that supplies power to the ultrasonic fingerprint sensor. ### Claim 5 (depends on 1) A method for manufacturing the IC card of claim 1, comprising: patterning a circuit comprising the IC chip, the ultrasonic fingerprint sensor, and the storage unit in the conductor layer on the polyimide base material of the flexible substrate; bonding the resin frame comprising a plurality of frame-shaped openings to the flexible substrate so that the circuit comprising the IC chip, the ultrasonic fingerprint sensor, and the storage unit is within a single frame-shaped opening of said plurality of frame-shaped openings and a resin of the resin frame surrounds the circuit; and filling and curing the synthetic resin inside the single frame-shaped opening to form the cured resin layer sealing the IC chip, the ultrasonic fingerprint sensor, and the storage unit. ### Claim 6 (depends on 5) The method of claim 5, further comprising sandwiching the flexible substrate with the resin frame and the formed cured resin layer between a first plastic sheet and a second plastic sheet and forming a laminate of the laminate of (a) the first plastic sheet, (b) the flexible substrate with the resin frame and the formed cured resin layer and (c) the second plastic sheet. ### Claim 7 (depends on 6) The method of claim 6, wherein each of the first plastic sheet and the second plastic sheet comprises a material selected from the group consisting of polyvinyl chloride (PVC), polyethylene terephthalate copolymer (PET-G), and polyethylene terephthalate (PET). ### Claim 8 (depends on 6) The method of claim 6, wherein the resin of the resin frame is selected from the group consisting of polyvinyl chloride (PVC), polyethylene terephthalate copolymer (PET-G), and polyethylene terephthalate (PET).