# US 12,216,154 B2 · Active thermal interposer device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,216,154 B2 - Document ID: US12216154B2 - Status: Granted - Kind: B2 - Application number: 18/204,309 - Filed: 2023-05-31 - Published: 2024-01-04 - Granted: 2025-02-04 - Earliest claimed: 2020-12-04 - Assignees: Advantest Test Solutions, Inc. - Applicants: Advantest Test Solutions, Inc. - Inventors: Samer Kabbani; Paul Ferrari; Ikeda Hiroki; Kiyokawa Toshiyuki; Gregory Cruzan; Karthik Ranganathan; Todd Berk; Ian Williams; Mohammad Ghazvini; Thomas Jones - Web page: https://patentgrep.com/patent/US12216154B2 ## CPC - G01R 31/2875: {related to heating} - G01R 1/0458: {related to environmental aspects, e.g. temperature} - G01R 31/2863: {Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04)} - G01R 31/2867: {Handlers or transport devices, e.g. loaders, carriers, trays} - G01R 31/2874: {related to temperature} - G01R 31/2868: {Complete testing stations; systems; procedures; software aspects} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A stand-alone active thermal interposer device for use in testing an unpackaged integrated circuit device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT. ## Claims ### Claim 1 A discrete active thermal interposer device for use in testing an unpackaged integrated circuit device under test (“DUT”), said discrete active thermal interposer device comprising: a body layer comprising a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate; and a plurality of heating zones defined across the second surface of said body layer, said plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when a surface of said DUT is disposed on said second surface of said body layer during testing of said DUT. ### Claim 2 (depends on 1) The active thermal interposer device as described in claim 1 wherein each heating zone of said plurality of heating zones comprises resistive traces for providing heat responsive to a voltage/current signal applied thereto as controlled by said thermal controller. ### Claim 3 (depends on 2) The active thermal interposer device as described in claim 2 wherein said body layer further comprises a plurality of pogo pin mechanical/electrical interfaces for mating with corresponding pogo pins of a thermal array, said plurality of pogo pin mechanical/electrical interfaces operable to input voltage/current signals from said thermal array for supply to said plurality of heating zones and also operable to output temperature sensor data corresponding to said plurality of heating zones. ### Claim 4 (depends on 2) The active thermal interposer device as described in claim 2 further comprising a grounded shield layer disposed on top of said second surface of said body layer and on top of said plurality of heating zones, said grounded shield layer operable to isolate said DUT from electro magnetic interference radiation resultant from energizing heating zones of said plurality of heating zones. ### Claim 5 (depends on 1) The active thermal interposer device as described in claim 1 wherein said body layer further comprises a two dimensional identification code viewable thereon and wherein said two dimensional identification code is operable to be machine read and provides one of: calibration values for a resistance temperature detector of the active thermal interposer device; identification information for identifying the active thermal interposer device; and security information for authenticating the active thermal interposer device. ### Claim 6 (depends on 1) The active thermal interposer device as described in claim 1 wherein said body layer further comprises alignment features disposed on said first surface, said alignment features for providing alignment between power pins of said active thermal interposer device and pads of a thermal head of a tester system, and wherein said thermal head comprises said cold plate. ### Claim 7 (depends on 1) The active thermal interposer device as described in claim 1 wherein said DUT comprises a single die. ### Claim 8 (depends on 1) The active thermal interposer device as described in claim 1 wherein said DUT comprises a plurality of die. ### Claim 9 (depends on 1) The active thermal interposer device as described in claim 1 further comprising a securing mechanism disposed with respect to said second surface of said body layer, said securing mechanism operable to secure said surface of said DUT to said second surface of said body layer during said testing. ### Claim 10 (depends on 1) The active thermal interposer device as described in claim 1 wherein said DUT comprises a die and wherein further said plurality of heating zones are operable to be selectively energized for selectively heating and maintaining temperatures of said die during said testing. ### Claim 11 (depends on 1) The active thermal interposer device as described in claim 1 further comprising a Peltier/TEC cooling layer disposed on said first surface of said body layer. ### Claim 12 (depends on 11) The active thermal interposer device as described in claim 11 wherein said body layer further comprises a plurality of pogo pin mechanical interfaces, said plurality of pogo pin mechanical interfaces operable to input voltage/current signals for supply to said plurality of heating zones and also operable to output temperature sensor data corresponding to said plurality of heating zones and also operable to input signals to control said Peltier/TEC cooling layer. ### Claim 13 A method of testing an unpackaged integrated circuit device under test (“DUT”) using an automated handler system and a tester system, said method comprising: using a handler, automatically picking up an active thermal interposer device and automatically positioning said active thermal interposer with respect to a thermal head and adjacent to a cold plate thereof; using said handler, automatically picking up said DUT from a tray and automatically placing said DUT adjacent to said active thermal interposer; using an optical sensor to determine if said DUT is aligned with respect to said active thermal interposer; and testing said DUT and concurrently during said testing maintaining a temperature thereof using said cold plate in combination with said active thermal interposer. ### Claim 14 (depends on 13) A method as described in claim 13 wherein said using a handler, automatically picking up an active thermal interposer device, is performed by a first pick-and-place head of said handler and wherein further said using said handler, automatically picking up said DUT from a tray and automatically placing said DUT adjacent to said active thermal interposer, is performed by a second pick-and-place head of said handler. ### Claim 15 (depends on 13) A method as described in claim 13 wherein said using a handler, automatically picking up an active thermal interposer device, further comprises using an optical reader to read a two dimensional identification code disposed on said active thermal interposer device and wherein further said two dimensional identification code provides information including one of: an identification of said active thermal interposer device; thermal calibration data regarding said active thermal interposer device; and authentication information regarding said active thermal interposer device and further comprising relaying said information to said tester system. ### Claim 16 (depends on 13) A method as described in claim 13 wherein said DUT comprises a single die. ### Claim 17 (depends on 13) A method as described in claim 13 wherein said DUT comprises a plurality of die. ### Claim 18 A method of testing an unpackaged integrated circuit device under test (DUT) using an automated handler system and a tester system, said method comprising: using a first pick-and-place head of said handler, automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device adjacent to a cold plate of a thermal head; using a second pick-and-place head of said handler, automatically picking up said DUT from a tray and automatically placing said DUT onto a surface of said active thermal interposer device; wherein said DUT is aligned with said active thermal interposer device using alignment features of said active thermal interposer device; and testing said DUT. ### Claim 19 (depends on 18) A method as described in claim 18 further comprising maintaining prescribed temperatures of said DUT during said testing using said cold plate in combination with said active thermal interposer device. ### Claim 20 (depends on 19) A method as described in claim 19 wherein said DUT comprises a single die.