Reticle thermal expansion calibration method capable of improving sub-recipe

A reticle thermal expansion calibration method comprising:

• exposing, by a scanner, a first group of wafers using a reticle;
• generating, by a computing system, a first sub-recipe based on temperature data collected during the exposure of the first group of wafers, wherein the first sub-recipe comprises exposure parameters for subsequent wafer exposures;
• performing, by the computing system, data mining and data parsing on the collected temperature data to generate a plurality of overlay parameters for the first group of wafers;
• extracting, by the computing system, a plurality of predetermined parameters from the plurality of overlay parameters for the first group of wafers, wherein the predetermined parameters are related to reticle thermal expansion compensation;
• performing, by the computing system, a linear regression on each of the predetermined parameters;
• and
• generating, by the computing system, a first coefficient of determination for each of the predetermined parameters;
• calibrating, by the computing system, the reticle thermal expansion compensation based on the first coefficient of determination for each of the predetermined parameters;
• and
• exposing, by the scanner, subsequent wafers using the calibrated reticle thermal expansion compensation.