# US 12,215,934 B2 · Thermal module structure

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- Number: US 12,215,934 B2
- Document ID: US12215934B2
- Status: Granted
- Kind: B2
- Application number: 18/064,291
- Filed: 2022-12-12
- Published: 2023-08-03
- Granted: 2025-02-04
- Earliest claimed: 2022-01-28
- Assignees: Asia Vital Components Co., Ltd.
- Applicants: Asia Vital Components Co., Ltd.
- Inventors: Sheng-Huang Lin; Yuan-Yi Lin
- Web page: https://patentgrep.com/patent/US12215934B2

## CPC

- F28F 21/089: {Coatings, claddings or bonding layers made from metals or metal alloys (F28F19/06 takes precedence)}
- H10W 40/73: for cooling by change of state
- F28D 15/0275: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores}
- F28F 1/325: {Fins with openings}
- H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps}
- F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)}
- F28F 1/32: the means having portions engaging further tubular elements
- F28F 21/084: {from aluminium or aluminium alloys}
- F28F 2275/06: by welding
- H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.

## Claims

### Claim 1

A thermal module structure, comprising:
an aluminum base having an upper surface, a lower surface, and at least one receiving section;
at least one copper heat pipe including a horizontally extended heat absorption section, a vertically extended heat dissipation section, and a substantially right-angled intermediate section; the intermediate section being connected at two ends to the heat absorption section and the heat dissipation section to give the copper heat pipe a substantially L-shaped configuration; and the heat absorption section being fitted in the receiving section of the aluminum base;
a first aluminum fin assembly including a plurality of first fins provided on the upper surface of the aluminum base; any two adjacent first fins together defining a first air flow passage between them, and the first air flow passages being oriented perpendicular to the upper surface of the aluminum base;
a second aluminum fin assembly including a plurality of second fins that are sequentially fastened to one another; every second fin being provided with at least one through hole to extend through the second fin in a thickness direction thereof for the heat dissipation section of the copper heat pipe to extend therethrough; any two adjacent second fins together defining a second air flow passage between them; and the second air flow passages being oriented parallel to the upper surface of the aluminum base to allow air flows in a direction perpendicular to the first air flow passage to flow through the second air flow passages; and
at least one copper embedding layer being formed on the upper surface and the receiving section of the aluminum base and on a bottom surface of the first aluminum fin assembly; the upper surface of the aluminum base and the bottom surface of the first aluminum fin assembly being connected to each other via the copper embedding layers, and the receiving section on the aluminum base and the heat absorption section of the copper heat pipe also being connected to one another via the copper embedding layer.

### Claim 2 (depends on 1)

The thermal module structure as claimed in claim 1, wherein the receiving section is in the form of a groove located at the lower surface of the aluminum base.

### Claim 3 (depends on 1)

The thermal module structure as claimed in claim 1, further comprising a copper heat transfer element having a heat transferring side and a copper embedding layer formed on the lower surface of the aluminum base; and the lower surface of the aluminum base being connected to the heat transferring side of the copper heat transfer element via the copper embedding layer.

### Claim 4 (depends on 1)

The thermal module structure as claimed in claim 1, wherein the copper embedding layers are formed on the bottom surface of the first aluminum fin assembly, the upper surface of the aluminum base, and the receiving section in a manner selected from the group consisting of mechanical processing, surface finishing, and chemical processing.

### Claim 5 (depends on 1)

The thermal module structure as claimed in claim 1, wherein the copper embedding layer includes a deepening surface and a connecting surface; the connecting surface being formed on the bottom surface of the first aluminum fin assembly, the upper surface of the aluminum base, and the receiving section; and the deepening surface deeply penetrating into the bottom surface of the first aluminum fin assembly, the upper surface of the aluminum base, and the receiving section.

### Claim 6 (depends on 1)

The thermal module structure as claimed in claim 1, wherein the through holes on the second fins respectively have a flange, which is projected from one side of the second fin to define a flange inner surface.

### Claim 7 (depends on 1)

The thermal module structure as claimed in claim 1, wherein the first fins are sequentially fastened to one another to form the first aluminum fin assembly on the upper surface of the aluminum base.