# US 12,215,259 B2 · Multilayer object and release agent composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,215,259 B2 - Document ID: US12215259B2 - Status: Granted - Kind: B2 - Application number: 17/801,016 - Filed: 2021-02-16 - Published: 2023-05-11 - Granted: 2025-02-04 - Earliest claimed: 2020-02-21 - Assignees: Nissan Chemical Corporation - Applicants: Nissan Chemical Corporation - Inventors: Hiroto Ogata; Tetsuya Shinjo - Web page: https://patentgrep.com/patent/US12215259B2 ## CPC - C09J 7/401: {characterised by the release coating composition} - H10P 72/74: {using temporarily an auxiliary support} - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - C08G 65/38: derived from phenols - C08J 7/12: Chemical modification - C09D 171/00: Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain (based on polyacetals C09D159/00; based on epoxy resins C09D163/00; based on polythioether-ethers C09D181/02; based on polyethersulfones C09D181/06); Coating compositions based on derivatives of such polymers - C09J 7/38: Pressure-sensitive adhesives [PSA] - C09J 183/04: Polysiloxanes - H10P 72/7448: {the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer} - B32B 9/005: {comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} - B32B 17/06: comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} - B32B 2255/26: Polymeric coating - B32B 2307/202: Conductive - B32B 2307/412: Transparent - B32B 2307/748: Releasability - C08G 77/12: containing silicon bound to hydrogen - C08G 77/20: containing silicon bound to unsaturated aliphatic groups - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - C09J 2483/00: Presence of polysiloxane - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) ## Abstract The invention provides a laminate having a first substrate formed of a semiconductor substrate; a second substrate formed of a light-transmissive support substrate; and an adhesive layer and a release layer disposed between the first substrate and the second substrate, characterized in that the release layer is a film formed from a releasing agent composition containing a polynuclear phenol derivative represented by formula (P) (wherein Ar represents an arylene group), a cross-linking agent, and at least one of an acid generator and an acid. ## Claims ### Claim 1 A laminate comprising: a first substrate formed of a semiconductor substrate; a second substrate formed of a light-transmissive support substrate; and an adhesive layer and a release layer disposed between the first substrate and the second substrate, wherein the release layer is a film formed from a releasing agent composition containing a polynuclear phenol derivative represented by formula (P): wherein Ar represents an arylene group, a cross-linking agent, and at least one of an acid generator and an acid. ### Claim 2 (depends on 1) The laminate according to claim 1, wherein the polynuclear phenol derivative is represented by formula (P-1): ### Claim 3 (depends on 2) The laminate according to claim 2, wherein the polynuclear phenol derivative is represented by formula (P-1-1): ### Claim 4 (depends on 3) The laminate according to claim 3, wherein the polynuclear phenol derivative is represented by formula (P1): ### Claim 5 (depends on 1) The laminate according to claim 1, wherein the cross-linking agent includes at least one species selected from among a phenolic cross-linking agent having a crosslink-forming group, a melamine cross-linking agent having a crosslink-forming group, a urea cross-linking agent having a crosslink-forming group, and a thiourea cross-linking agent having a crosslink-forming group. ### Claim 6 (depends on 5) The laminate according to claim 5, wherein the cross-linking agent contains a phenolic cross-linking agent having a crosslink-forming group. ### Claim 7 (depends on 1) The laminate according to claim 1, wherein the releasing agent composition contains an acid. ### Claim 8 (depends on 7) The laminate according to claim 7, wherein the acid includes at least one species selected from among an arylsulfonic acid, an arylsulfonic acid salt, an arylcarboxylic acid, an arylcarboxylic acid salt, a chain or cyclic alkylsulfonic acid, a chain or cyclic alkylsulfonic acid salt, a chain or cyclic alkylcarboxylic acid, and a chain or cyclic alkylcarboxylic acid. ### Claim 9 (depends on 1) The laminate according to claim 1, wherein the adhesive layer is a film formed from an adhesive composition containing an adhesive component (S) containing at least one species selected from among a silicone adhesive, an acrylic resin adhesive, an epoxy resin adhesive, a polyamide adhesive, a polystyrene adhesive, a polyimide adhesive, and a phenolic resin adhesive. ### Claim 10 (depends on 9) The laminate according to claim 9, wherein the adhesive component (S) contains a silicone adhesive. ### Claim 11 (depends on 10) The laminate according to claim 10, wherein the silicone adhesive contains a polysiloxane component (A) which is cured through hydrosilylation. ### Claim 12 A releasing agent composition containing a polynuclear phenol derivative represented by formula (P): wherein Ar represents an arylene group, a cross-linking agent, and at least one of an acid generator and an acid. ### Claim 13 (depends on 12) The releasing agent composition according to claim 12, wherein the polynuclear phenol derivative is represented by formula (P-1): ### Claim 14 (depends on 13) The releasing agent composition according to claim 13, wherein the polynuclear phenol derivative is represented by formula (P-1-1): ### Claim 15 (depends on 14) The releasing agent composition according to claim 14, wherein the polynuclear phenol derivative is represented by formula (P1): ### Claim 16 (depends on 12) The releasing agent composition according to claim 12, wherein the cross-linking agent includes at least one species selected from among a phenolic cross-linking agent having a crosslink-forming group, a melamine cross-linking agent having a crosslink-forming group, a urea cross-linking agent having a crosslink-forming group, and a thiourea cross-linking agent having a crosslink-forming group. ### Claim 17 (depends on 12) The releasing agent composition according to claim 12, wherein the cross-linking agent contains a phenolic cross-linking agent having a crosslink-forming group. ### Claim 18 (depends on 12) The releasing agent composition according to claim 12, wherein the releasing agent composition contains an acid. ### Claim 19 (depends on 18) The releasing agent composition according to claim 18, wherein the acid includes at least one species selected from among an arylsulfonic acid, an arylsulfonic acid salt, an arylcarboxylic acid, an arylcarboxylic acid salt, a chain or cyclic alkylsulfonic acid, a chain or cyclic alkylsulfonic acid salt, a chain or cyclic alkylcarboxylic acid, and a chain or cyclic alkylcarboxylic acid. ### Claim 20 (depends on 12) The releasing agent composition according to claim 12, the releasing agent composition used for forming a release layer of a laminate, the laminate having a first substrate formed of a semiconductor substrate; a second substrate formed of a light-transmissive support substrate; and an adhesive layer and the release layer disposed between the first substrate and the second substrate.