# US 12,215,018 B2 · Method for manufacturing package structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,215,018 B2 - Document ID: US12215018B2 - Status: Granted - Kind: B2 - Application number: 18/609,571 - Filed: 2024-03-19 - Published: 2024-07-04 - Granted: 2025-02-04 - Earliest claimed: 2020-12-14 - Assignees: Winbond Electronics Corp. - Applicants: Winbond Electronics Corp. - Inventors: Jin-Neng Wu - Web page: https://patentgrep.com/patent/US12215018B2 ## CPC - B81B 3/0018: {Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators} - B81C 1/00238: {Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure} - B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) - B81C 3/001: {Bonding of two components} - B81B 2201/0214: Biosensors; Chemical sensors - B81B 2201/03: Microengines and actuators - B81B 2203/033: Trenches - B81B 2207/07: Interconnects - B81B 2207/09: Packages - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract A method for manufacturing package structure is provided, including: providing a substrate having recesses; forming first MEMS chips on the substrate, each with a through-substrate via, and a first sensor or microactuator on the lower surface, located in one of the recesses; forming first intermediate chips on the substrate, each respectively on one of the first MEMS chips, having a through-substrate via, and including a signal conversion unit, a logic operation unit, control unit, or a combination thereof; forming second MEMS chips on the first intermediate chips, each with a through-substrate via, having a second sensor or microactuator on its upper surface, wherein the package structure includes at least one of the first sensor and the second sensor; and forming first capping plates on the second MEMS chips, each providing a receiving space for the second sensor or microactuator on the upper surface of each second MEMS chip. ## Claims ### Claim 1 A method for manufacturing a package structure, comprising: providing a substrate, wherein the substrate has a plurality of recesses; forming a plurality of first MEMS chips on the substrate, wherein each of the first MEMS chips has a through-substrate via, a lower surface of each of the first MEMS chips has a first sensor or microactuator formed on the through-substrate via, and the first sensor or the microactuator is located in one of the recesses; forming a plurality of first intermediate chips on the substrate, wherein each of the first intermediate chips is respectively formed on one of the first MEMS chips, wherein each of the first intermediate chips has a through-substrate via, and wherein each of the first intermediate chips comprises a signal conversion unit, a logic operation unit, a control unit, or a combination thereof; forming a plurality of second MEMS chips on the first intermediate chips, wherein each of the second MEMS chips has a through-substrate via, wherein an upper surface of each of the second MEMS chips has a second sensor or a microactuator formed on the through-substrate via, and wherein the package structure comprises at least one of the first sensor and the second sensor; and forming a plurality of first capping plates on the second MEMS chips, wherein each of the first capping plates provides a receiving space, and wherein the second sensor or the microactuator located on the upper surface of each of the second MEMS chips is located in the receiving space. ### Claim 2 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, further comprising: forming a first molding compound layer to cover the first MEMS chips; performing a first planarization process to expose upper surfaces of the first MEMS chips, so that the upper surfaces of the first MEMS chips and an upper surface of the first molding compound layer are coplanar; forming a first redistribution layer on the first MEMS chip; forming a second molding compound layer to cover the first intermediate chips; performing a second planarization process to expose upper surfaces of the first intermediate chips, so that the upper surfaces of the first intermediate chips and an upper surface of the second molding compound layer are coplanar; forming a second redistribution layer on the first intermediate chip; and performing a cutting process on the first redistribution layer, the first molding compound layer, the second redistribution layer, the second molding compound layer, and the substrate. ### Claim 3 (depends on 2) The method for manufacturing the package structure as claimed in claim 2, further comprising: curing the second molding compound layer after forming the second molding compound layer to cover the first intermediate chips. ### Claim 4 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, further comprising: forming a second intermediate chip between the first MEMS chip and the second MEMS chip, wherein the second intermediate chip has a through-substrate via, and the second intermediate chip comprises a memory unit, an antenna unit, or a combination thereof. ### Claim 5 (depends on 4) The method for manufacturing the package structure as claimed in claim 4, further comprising: forming a third intermediate chip between the first MEMS chip and the second MEMS chip, wherein the third intermediate chip has a through-substrate via, and the third intermediate chip comprises a memory unit, an antenna unit, or a combination thereof. ### Claim 6 (depends on 5) The method for manufacturing the package structure as claimed in claim 5, wherein a size of the third intermediate chip is smaller than a size of the first intermediate chip. ### Claim 7 (depends on 5) The method for manufacturing the package structure as claimed in claim 5, wherein a size of the second MEMS chip is larger than a sum of the size of the first intermediate chip, the size of the second intermediate chip, and the size of the third intermediate chip. ### Claim 8 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, further comprising: forming a third MEMS chip on the first intermediate chip and arranged horizontally with the second MEMS chip, wherein an upper surface of the third MEMS chip has a third sensor or a microactuator; and forming a second capping plate on the third MEMS chip, wherein the third sensor or the microactuator located on the upper surface of the third MEMS chip is located in a receiving space provided by the second capping plate. ### Claim 9 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, further comprising: forming a third MEMS chip between the first intermediate chip and the second MEMS chip, wherein an upper surface of the third MEMS chip has a third sensor or a microactuator; and forming a second capping plate on the third MEMS chip, wherein the third sensor or the microactuator located on the upper surface of the third MEMS chip is located in a receiving space provided by the second capping plate. ### Claim 10 (depends on 9) The method for manufacturing the package structure as claimed in claim 9, wherein a sidewall of the second capping plate has an opening. ### Claim 11 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, further comprising: forming a first redistribution layer between the first MEMS chip and the first intermediate chip; forming a second redistribution layer between the first intermediate chip and the second MEMS chip; and forming a filling medium in at least one of the recess and the receiving space. ### Claim 12 (depends on 11) The method for manufacturing the package structure as claimed in claim 11, wherein the first redistribution layer comprises an electrical connecting element formed therein, and the electrical connecting element is exposed from an upper surface of the first redistribution layer. ### Claim 13 (depends on 11) The method for manufacturing the package structure as claimed in claim 11, wherein the first redistribution layer comprises an electrical connecting element formed therein, and the electrical connecting element partially protrudes from an upper surface of the first redistribution layer. ### Claim 14 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, wherein the upper surface of the first capping plate has an opening, so that the receiving space becomes an open space. ### Claim 15 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, wherein a size of the second intermediate chip is smaller than a size of the first intermediate chip. ### Claim 16 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, wherein the recess is a closed space, and a filling medium is formed in the recess. ### Claim 17 (depends on 1) The method for manufacturing the package structure as claimed in claim 1, wherein a bottom surface of the first sensor is lower than the top surface of the first MEMS chip. ### Claim 18 (depends on 17) The method for manufacturing the package structure as claimed in claim 17, wherein an upper surface of the second sensor is higher than the top surface of the second MEMS chip.