# US 12,214,580 B2 · Method for transferring a layer to a substrate

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- Number: US 12,214,580 B2
- Document ID: US12214580B2
- Status: Granted
- Kind: B2
- Application number: 17/834,413
- Filed: 2022-06-07
- Published: 2022-12-15
- Granted: 2025-02-04
- Earliest claimed: 2021-06-09
- Assignees: Imec Vzw; Katholieke Universiteit Leuven, KU LEUVEN R&D
- Applicants: Imec Vzw; Katholieke Universiteit Leuven, KU LEUVEN R&D
- Inventors: Boshen Liang; Dominika Wysocka; David Cheyns
- Web page: https://patentgrep.com/patent/US12214580B2

## CPC

- B32B 43/006: {Delaminating}
- H10P 90/1904: {Preparing vertically inhomogeneous wafers}
- B32B 37/24: with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate (B32B37/15 takes precedence)
- B81C 1/00238: {Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure}
- B32B 2037/243: {Coating}
- B81C 2203/0785: Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.

## Claims

### Claim 1

A method comprising:
providing a stack by:
forming a first transfer layer over a first substrate;
forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble; and
forming a target layer in contact with the second transfer layer such that the target layer forms a top surface of the stack;
bonding the top surface of the stack to a second substrate;
separating the first transfer layer from the second transfer layer; and
removing the second transfer layer from the target layer such that the target layer remains on the second substrate.

### Claim 2 (depends on 1)

The method of claim 1, wherein removing the second transfer layer comprises dissolving the second transfer layer.

### Claim 3 (depends on 2)

The method of claim 2, wherein dissolving the second transfer layer comprises dissolving the second transfer layer in water.

### Claim 4 (depends on 3)

The method according to claim 3, wherein dissolving the second transfer layer comprises dissolving the second transfer layer at room temperature.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the target layer comprises an elastomer layer.

### Claim 6 (depends on 5)

The method according to claim 5, wherein the elastomer layer has a Young's modulus equal to or less than 500 MPa at room temperature.

### Claim 7 (depends on 5)

The method according to claim 5, wherein the target layer further comprises a conductive layer.

### Claim 8 (depends on 7)

The method according to claim 7, wherein forming the target layer comprises forming the conductive layer and then forming the elastomer layer.

### Claim 9 (depends on 7)

The method according to claim 7, wherein the conductive layer is a thin film metal layer.

### Claim 10 (depends on 7)

The method according to claim 7, wherein the conductive layer is an inorganic layer.

### Claim 11 (depends on 1)

The method according to claim 1, wherein the second substrate comprises a glass supporting substrate.

### Claim 12 (depends on 1)

The method according to claim 1, wherein the second substrate comprises an elastomer layer.

### Claim 13 (depends on 12)

The method of claim 12, wherein the elastomer layer comprises a channel configured for microfluidic flow.

### Claim 14 (depends on 1)

The method according to claim 1, wherein the first substrate is transparent.

### Claim 15 (depends on 1)

The method of claim 1, wherein the first transfer layer is an optically sensitive layer.

### Claim 16 (depends on 1)

The method of claim 1, wherein separating the first transfer layer from the second transfer layer comprises separating the first transfer layer from the second transfer layer by exposure to a laser source.

### Claim 17 (depends on 1)

The method of claim 1, wherein the second transfer layer comprises a polyvinyl alcohol.

### Claim 18 (depends on 1)

The method of claim 1, wherein separating the first transfer layer from the second transfer layer comprises using heat to remove the first transfer layer.

### Claim 19

A method comprising:
providing a first stack by:
forming a first transfer layer over a first substrate;
forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble; and
forming a target layer on the second transfer layer such that the target layer forms a first top surface of the first stack;
bonding the first top surface of the first stack to a second top surface of a second substrate stack that comprises a support structure, a patterned elastomer layer forming the second top surface, and a patterned thin film layer between the support structure and the patterned elastomer layer, wherein the patterned thin film layer comprises electronic circuitry configured for controlling a microfluidic device;
separating the first transfer layer from the second transfer layer; and
removing the second transfer layer from the target layer such that the target layer remains on the second substrate stack.

### Claim 20 (depends on 19)

The method of claim 19, wherein the electronic circuitry is configured for controlling fluid flow through the target layer or through the patterned elastomer layer.