# US 12,214,442 B2 · Variable-pulse-width flat-top laser device and operating method therefor

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- Number: US 12,214,442 B2
- Document ID: US12214442B2
- Status: Granted
- Kind: B2
- Application number: 18/424,662
- Filed: 2024-01-26
- Published: 2024-06-27
- Granted: 2025-02-04
- Earliest claimed: 2020-02-12
- Assignees: Eo Technics Co., Ltd.
- Applicants: Eo Technics Co., Ltd.
- Inventors: Kyu Dong Sung; Jeen Hur; Eun Kyong Moon; Hans Juergen Kahlert
- Web page: https://patentgrep.com/patent/US12214442B2

## CPC

- B23K 26/0604: {by a combination of beams}
- B23K 26/067: Dividing the beam into multiple beams, e.g. multi-focusing
- B23K 26/034: {Observing the temperature of the workpiece}
- B23K 26/0622: by shaping pulses
- B23K 26/0626: {Energy control of the laser beam (B23K26/0622 takes precedence)}
- B23K 26/0643: {comprising mirrors}
- B23K 26/0648: {comprising lenses}
- B23K 26/0676: {into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations}
- B23K 26/0732: {into a rectangular shape}
- H10P 14/381: {Beam shaping, e.g. using a mask}
- H10P 14/3816: {Pulsed laser beam}
- H10P 72/00: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a laser device. A laser device includes a light source unit configured to emit a first laser beam and a second laser beam, and a beam shaping unit configured to receive the first laser beam and the second laser beam on an incident surface and to shape the first laser beam and the second laser beam into a first processing beam, wherein the beam shaping unit is further configured, to have the incident surface including four quadrants, to receive the first laser beam on a first quadrant and the second laser beam on a second quadrant, and to shape the first laser beam and the second laser beam being emitted at different timing from the first laser beam into the first processing beam.

## Claims

### Claim 1

A laser device comprising:
a light source configured to emit a plurality of laser beams including a first to fourth laser beams; and
a homogenizer configured to receive the plurality of laser beams on an incident surface of the homogenizer and to form at least one processing beam based on the plurality of laser beams, the at least one processing beam being used for processing a target object,
wherein the homogenizer is further configured:
to have the incident surface including four quadrants arranged along two axes perpendicular to each other, with each quadrant receiving at least some of the plurality of laser beams, and
to shape the plurality of laser beams being emitted at different timings into at least one processing beam.

### Claim 2 (depends on 1)

The laser device of claim 1, wherein the at least one processing beam includes a first processing beam shaped from the first to third laser beams,
wherein the homogenizer is further configured to shape the fourth laser beam into a second processing beam, and
wherein a pulse width of the first processing laser beam is greater than a pulse width of the second processing laser beam.

### Claim 3 (depends on 1)

The laser device of claim 1, wherein the first laser beam is emitted at a first timing, the second laser beam is emitted at a second timing after the first timing and the third laser beam is emitted at a third timing, and
wherein a first time difference between the first timing and the second timing is same with a second time difference between the second timing and the third timing.

### Claim 4 (depends on 3)

The laser device of claim 3, wherein the fourth laser beam is emitted at a fourth timing, and
wherein a third time difference between the third timing and the fourth timing is greater than the first time difference and the second time difference.

### Claim 5 (depends on 1)

The laser device of claim 1, wherein the at least one processing beam includes a first processing beam shaped from the first to third laser beams,
wherein the first laser beam is emitted at a first timing, the second laser beam is emitted at a second timing after the first timing and the third laser beam is emitted at a third timing,
wherein a pulse width of the first processing beam is adjusted based on a first time difference between the first timing and the second timing and a second time difference between the second timing and the third timing, and
wherein a heating temperature of a processing surface of the target object is controlled based on the pulse width of the first processing beam.

### Claim 6 (depends on 1)

The laser device of claim 1, wherein the at least one processing beam is a flat-top laser beam.

### Claim 7 (depends on 1)

The laser device of claim 1, further comprising:
an imaging optics includes a lens and a mirror for focusing the at least one processing beam on the target object.

### Claim 8 (depends on 1)

The laser device of claim 1, further comprising:
a stage on which the target object is mounted,
wherein an annealing process is performed by emitting the at least one processing beam to the target object.

### Claim 9 (depends on 1)

The laser device of claim 1, wherein the light source comprises a first laser light source emitting the first laser beam and a second laser light source emitting the second laser beam.

### Claim 10

An operating method of a laser device, the operating method comprising:
emitting, by a light source, a plurality of laser beams including a first to fourth laser beams at different timings;
causing, by an optical component, the plurality of laser beams to be incident on an incident surface of a homogenizer, wherein the incident surface includes four quadrants arranged along two axes perpendicular to each other, with each quadrant receiving at least some of the plurality of laser beams; and
shaping, by the homogenizer, the plurality of laser beams being emitted at different timings into at least one processing beam, the at least one processing beam being used for processing a target object.

### Claim 11 (depends on 10)

The operating method of claim 10, wherein the at least one processing beam includes a first processing beam shaped from the first to third laser beams,
wherein the homogenizer is further configured to shape the fourth laser beam into a second processing beam, and
wherein a pulse width of the first processing laser beam is greater than a pulse width of the second processing laser beam.

### Claim 12 (depends on 10)

The operating method of claim 10, wherein the first laser beam is emitted at a first timing, the second laser beam is emitted at a second timing after the first timing and the third laser beam is emitted at a third timing, and
wherein a first time difference between the first timing and the second timing is same with a second time difference between the second timing and the third timing.

### Claim 13 (depends on 12)

The operating method of claim 12, wherein the fourth laser beam is emitted at a fourth timing, and
wherein a third time difference between the third timing and the fourth timing is greater than the first time difference and the second time difference.

### Claim 14 (depends on 10)

The operating method of claim 10, wherein the at least one processing beam includes a first processing beam shaped from the first to third laser beams,
wherein the first laser beam is emitted at a first timing, the second laser beam is emitted at a second timing after the first timing and the third laser beam is emitted at a third timing,
wherein a pulse width of the first processing beam is adjusted based on a first time difference between the first timing and the second timing and a second time difference between the second timing and the third timing, and
wherein a heating temperature of a processing surface of the target object is based on controlled the pulse width of the first processing beam.

### Claim 15 (depends on 10)

The operating method of claim 10, wherein the at least one processing beam is a flat-top laser beam.

### Claim 16 (depends on 10)

The operating method of claim 10, further comprising:
focusing, by an imaging optics including a lens and a mirror, the at least one processing beam on the target object.

### Claim 17 (depends on 10)

The operating method of claim 10,
wherein an annealing process is performed by emitting the at least one processing beam to the target object.

### Claim 18 (depends on 10)

The operating method of claim 10, wherein the light source comprises a first laser light source emitting the first laser beam and a second laser light source emitting the second laser beam.