# US 12,214,436 B2 · Laser soldering system and light shaping method thereof

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- Number: US 12,214,436 B2
- Document ID: US12214436B2
- Status: Granted
- Kind: B2
- Application number: 17/643,189
- Filed: 2021-12-08
- Published: 2023-01-26
- Granted: 2025-02-04
- Earliest claimed: 2021-07-22
- Assignees: Delta Electronics, Inc.
- Applicants: Delta Electronics, Inc.
- Inventors: Yu-Chen Chang; Chun-Fei Kung; Shih-Yung Chiu; Shu-Han Wu
- Web page: https://patentgrep.com/patent/US12214436B2

## CPC

- B23K 1/0056: {soldering by means of beams, e.g. lasers, electron beams [EB]}
- B23K 3/04: Heating appliances
- B23K 26/034: {Observing the temperature of the workpiece}
- B23K 26/048: {by controlling the distance between laser head and workpiece}
- B23K 26/0604: {by a combination of beams}
- B23K 26/0626: {Energy control of the laser beam (B23K26/0622 takes precedence)}
- B23K 26/0648: {comprising lenses}
- B23K 26/0676: {into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations}
- B23K 26/0734: {into an annular shape}
- B23K 26/20: Bonding (soldering by means of radiant energy B23K1/005)
- B23K 26/34: Laser welding for purposes other than joining
- G02B 5/001: {Axicons, waxicons, reflaxicons}
- G02B 27/0916: {Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers (coupling into light guides using intermediate optical elements G02B6/4204; details of lighting devices in general F21V)}
- G02B 27/0938: {Using specific optical elements}
- G02B 27/281: {used for attenuating light intensity, e.g. comprising rotatable polarising elements}
- G02B 27/283: {used for beam splitting or combining}
- G02B 27/286: {for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another (G02B5/3083 takes precedence; light guide coupling means utilising polarising elements G02B6/34)}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.

## Claims

### Claim 1

A laser soldering system, applying for processing a first element and a second element with different processing temperatures, wherein the first element is adjacent to the second element, and the laser soldering system comprises:
a laser source module configured to emit a laser beam;
a polarization adjusting assembly, comprising:
a plurality of polarization elements configured to split the laser beam into a Gaussian beam and a ring-shaped beam, wherein the Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element; and
at least one stepping motor configured to adjust a size of the ring-shaped beam;
a temperature sensor configured to monitor a temperatures of the first element and a temperature of the second element; and
a controller electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.

### Claim 2 (depends on 1)

The laser soldering system of claim 1, wherein the polarization elements further comprises:
a first polarization beam splitter configured to split the laser beam into a first arm and a second arm; and
a second polarization beam splitter configured to combine the first arm and the second arm, and the second arm is the Gaussian beam.

### Claim 3 (depends on 2)

The laser soldering system of claim 2, wherein the polarization elements further comprises:
an axicon lens assembly located along the first arm, wherein the axicon lens assembly is located between the first polarization beam splitter and the second polarization beam splitter, and the axicon lens assembly is configured to form the ring-shaped beam.

### Claim 4 (depends on 3)

The laser soldering system of claim 3, wherein the axicon lens assembly further comprises:
two axicon lenses, respectively comprises a flat top surface, and the stepping motor is configured to adjust a distance between the two axicon lenses.

### Claim 5 (depends on 2)

The laser soldering system of claim 2, wherein the polarization elements further comprises:
at least one wave plate located between the first polarization beam splitter and the second polarization beam splitter, and the wave plate is configured to adjust a power of at least one of the first arm and the second arm.

### Claim 6 (depends on 1)

The laser soldering system of claim 1, wherein the first element is a pin, and the second element is a solder pad.

### Claim 7

A beam shaping method of a laser soldering system, comprising steps of:
emitting a laser beam by a laser source module;
performing a laser calibration step, comprising steps of:
splitting the laser beam into a Gaussian beam and a ring-shaped beam by a polarization adjusting assembly;
adjusting sizes of the Gaussian beam and the ring-shaped beam by the polarization adjusting assembly; and
judging a power ratio between the Gaussian beam and the ring-shaped beam; and
performing a laser processing step, wherein the Gaussian beam illuminates a first element, and the ring-shaped beam illuminates a second element, the first element is adjacent to the second element, and the laser processing step further comprises:
monitoring a temperature of the first element and a temperature of the second element by a temperature sensor; and
adjusting a power of the Gaussian beam and a power of the ring-shaped beam based on a monitoring result from the temperature sensor.

### Claim 8 (depends on 7)

The beam shaping method of claim 7, wherein splitting the laser beam into the Gaussian beam and the ring-shaped beam by the polarization adjusting assembly further comprising a step of:
splitting the laser beam into a first arm and a second arm by a first polarization beam splitter.

### Claim 9 (depends on 8)

The beam shaping method of claim 8, wherein splitting the laser beam into the Gaussian beam and the ring-shaped beam by the polarization adjusting assembly further comprising a step of:
combining the first arm and the second arm by a second polarization beam splitter, wherein the second arm is the Gaussian beam.

### Claim 10 (depends on 8)

The beam shaping method of claim 8, wherein splitting the laser beam into the Gaussian beam and the ring-shaped beam by the polarization adjusting assembly further comprising a step of:
forming the ring-shaped beam from the first arm passed the first polarization beam splitter by an axicon lens assembly.

### Claim 11 (depends on 10)

The beam shaping method of claim 10, wherein the axicon lens assembly comprises two axicon lenses each having a flat top surface, and adjusting the size of the ring-shaped beam further comprises a step of:
adjusting a distance between the two axicon lenses by a stepping motor.

### Claim 12 (depends on 8)

The beam shaping method of claim 8, wherein judging the power ratio between the Gaussian beam and the ring-shaped beam further comprises a step of:
adjusting a power of at least one of the first arm and the second arm by at least one wave plate.

### Claim 13 (depends on 8)

The beam shaping method of claim 8, wherein adjusting the size of the Gaussian beam further comprises a step of:
adjusting a working distance between the combined laser beam to the first element and the second element so as to adjust the size of the Gaussian beam.

### Claim 14 (depends on 7)

The beam shaping method of claim 7, wherein judging the power ratio between the Gaussian beam and the ring-shaped beam further comprises a step of:
reducing a difference between a temperature rising curve of the first element and a temperature rising curve of the second element.

### Claim 15 (depends on 7)

The beam shaping method of claim 7, wherein adjusting the power of the Gaussian beam and the power of the ring-shaped beam based on the monitoring result from the temperature sensor further comprises a step of:
adjusting a laser beam output intensity of the laser source module.

### Claim 16 (depends on 7)

The beam shaping method of claim 7, wherein the first element is a pin, and the second element is a soldering pad.