Ultrasonic touch sensor
AssigneeInfineon Technologies AG
InventorsRainer Markus Schaller, Jochen Dangelmaier, Klaus Elian, Horst Theuss
Life of this patent
Estimating the term…
Abstract
An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.
Claims26
An ultrasonic touch sensor for attaching to a casing, the ultrasonic touch sensor comprising:
- a semiconductor chip which has a substrate side and a component side,
- wherein the semiconductor chip comprises an ultrasonic transducer element that includes a first electrode, a second electrode, and a diaphragm configured to be stimulated by an alternating voltage applied between the first electrode and the second electrode, and
- wherein the ultrasonic transducer element is arranged on the component side;
- an acoustic coupling medium covering the component side of the semiconductor chip at least in a region of the ultrasonic transducer element;
- and
- electrical contact elements for controlling the ultrasonic transducer element via connections to the first electrode and the second electrode,
- wherein the electrical contact elements are arranged on the component side of the semiconductor chip, and
- wherein the acoustic coupling medium is arranged laterally between the electrical contact elements such that lateral sides of the electrical contact elements are in contact with the acoustic coupling medium.
Dependencies are inferred from the claim text.