Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device
AssigneeToray Industries, Inc.
InventorsKeika Hashimoto, Yuki Masuda, Yuki Takeyama
Life of this patent
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AssigneeToray Industries, Inc.
InventorsKeika Hashimoto, Yuki Masuda, Yuki Takeyama
Estimating the term…
Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 μm or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).
A resin composition comprising:
Dependencies are inferred from the claim text.