Semiconductor package and manufacturing method thereof

A semiconductor package, comprising:

• a first die stack structure and a second die stack structure arranged side by side, wherein each of the first die stack structure and the second die stack structure comprises:
• an electronic die;
• and
• a photonic die bonded to the electronic die;
• an insulating encapsulation laterally encapsulating the first die stack structure and the second die stack structure;
• a redistribution structure disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure;
• a first prism structure and a second prism structure disposed within the redistribution structure, wherein the first prism structure extends over and optically coupled to the photonic die of the first die stack structure and the photonic die of the second die stack structure, and the second prism structure extends over and optically coupled to the photonic die of the second die stack structure;
• first reflectors disposed on the first prism structure;
• a second reflector disposed on the second prism structure;
• and
• an optical signal source facing and aligned with the second prism structure.

A manufacturing method of a semiconductor package, comprising:

• arranging a first die stack structure and a second die stack structure side by side over a carrier, wherein each of the first die stack structure and the second die stack structure comprises:
• an electronic die;
• and
• a photonic die electronically communicating with the electronic die;
• laterally encapsulating the first die stack structure and the second die stack structure with an insulating encapsulation;
• forming a redistribution structure over the insulating encapsulation, the first die stack structure and the second die stack structure, wherein the redistribution structure is electrically connected with the first die stack structure and the second die stack structure;
• forming at least one prism structure within the redistribution structure;
• forming at least one reflector to be in contact with the at least one prism structure;
• performing a singulation process to cut off the insulating encapsulation, the redistribution structure, the at least one prism structure to form a coterminous sidewall;
• and
• disposing an optical signal source over the coterminous sidewall to align the optical signal source to the at least one prism structure.