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US 12,209,357 B2Granted
Non-woven film for electronic components and fabricating method thereof
AssigneeTaiwan Textile Research Institute
InventorsShao-Yen Chang, Shang-Chih Chou, Chun-Hung Lin
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Abstract
A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.
Claims4
A non-woven film for electronic components, comprising:
- a polyetherimide substrate;
- and
- an aerogel disposed on the polyetherimide substrate and having a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%, wherein a particle size (D90) of the aerogel is between 100 nm and 200 nm.
Dependencies are inferred from the claim text.