Nanofiltration for wafer rinsing
AssigneeApplied Materials, Inc.
InventorJohn L. Klocke
Life of this patent
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Abstract
The present technology includes methods for rinsing an electroplating apparatus, a component thereof, and/or a substrate. The method includes removing at least a portion of a bath solution having a first pH from an electroplating bath. The method includes filtering the removed bath solution through a nanofiltration membrane, forming a permeating containing a recycled rinse agent, and a retentate. The method includes transferring the recycled rinse agent to the one or more nozzles and rinsing the electroplating apparatus, component thereof, and/or substrate. The method includes where the recycled rinse agent is characterized by a second pH, where the second pH varies from the first pH by less than or about 5.
Claims20
A method for rinsing an electroplating apparatus, a component thereof, and/or a substrate, comprising:
- draining at least a portion of a bath solution having a first pH from an electroplating bath to a recycling unit;
- filtering the drained bath solution through a nanofiltration membrane, forming a permeate containing a recycled rinse agent and a retentate;
- transferring the recycled rinse agent to one or more nozzles;
- and
- rinsing the electroplating apparatus, the component thereof, or the substrate with the recycled rinse agent;
- wherein the nanofiltration membrane is selected to produce the recycled rinse agent is characterized by a second pH, wherein the second pH varies from the first pH by less than or about 5 without additional pH adjusting agents.
An electroplating system comprising,
- a plating system comprising a plating bath containing a bath solution, a head comprising a seal, a substrate coupled with the seal, and at least a first rinse nozzle, wherein the bath solution is characterized by a first pH;
- a recycling unit comprising at least a first filtration unit and a pump, the first filtration unit being characterized by a nanofiltration membrane;
- a recycling unit conduit fluidly connecting the plating bath and the recycling unit;
- a first filtration unit retentate conduit connecting the recycling unit to the plating bath;
- and
- a first filtration unit permeate conduit connecting the recycling unit to the at least a first rinse nozzle, wherein the nanofiltration membrane is selected to produce the permeate is characterized by a second pH, wherein the second pH varies from the first pH by less than or about 5 without additional pH adjusting agents.
A method for rinsing an electroplating apparatus, a component thereof, and/or a substrate,
- the electroplating apparatus comprising a plating bath containing a bath solution, a head comprising a seal, a substrate coupled with the seal, and at least a first rinse nozzle, the method comprising:
- moving the head from a first position to a second position;
- removing at least a portion of a bath solution having a first pH from an electroplating bath;
- filtering the bath solution through a nanofiltration membrane, forming a permeate containing a recycled rinse agent and a retentate;
- transferring the recycled rinse agent to one or more nozzles;
- and
- rinsing the head, the seal, or a combination thereof;
- wherein the nanofiltration membrane is selected to produce the recycled rinse agent is characterized by a second pH, wherein the second pH varies from the first pH by less than or about 5 without additional pH adjusting agents.
Dependencies are inferred from the claim text.