Metal member and production method therefor
AssigneesNgk Electronics Devices, Inc., NGK Insulators, Ltd.
InventorShigeru Yoshimura
Life of this patent
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Abstract
A metal member includes a metal substrate, a first intermediate plating layer, a second intermediate plating layer, and a precious metal plating layer. The metal substrate includes a surface constituted of a plurality of crystal grains. The first intermediate plating layer is directly formed on the plurality of crystal grains of the metal substrate, contains a nickel element, and is non-oriented with respect to each crystal orientation of the plurality of crystal grains of the metal substrate. The second intermediate plating layer is directly formed on the first intermediate plating layer. The precious metal plating layer is formed on the second intermediate plating layer.
Claims14
A metal member comprising:
- a metal member having a mounting surface on which an electronic component is to be mounted, comprising:
- a metal substrate being a heat sink plate, including a surface constituted of a plurality of crystal grains;
- a first intermediate plating layer being directly formed on the plurality of crystal grains of the metal substrate, containing a nickel element, and being non-oriented with respect to each crystal orientation of the plurality of crystal grains of the metal substrate;
- a second intermediate plating layer being directly formed on the first intermediate plating layer;
- and
- a precious metal plating layer being formed on the second intermediate plating layer;
- a package-frame disposed on the heat sink plate and;
- a lead frame fixed to the package-frame;
- and
- wherein the electronic component is a power semiconductor element.
Dependencies are inferred from the claim text.