Arched membrane structure for MEMS device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJhao-Yi Wang, Chin-Yu Ku, Wen-Hsiung Lu, Lung-Kai Mao, Ming-Da Cheng
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Abstract
A method includes bonding a supporting substrate to a semiconductor substrate of a wafer. A bonding layer is between, and is bonded to both of, the supporting substrate and the semiconductor substrate. A first etching process is performed to etch the supporting substrate and to form an opening, which penetrates through the supporting substrate and stops on the bonding layer. The opening has substantially straight edges. The bonding layer is then etched. A second etching process is performed to extend the opening down into the semiconductor substrate. A bottom portion of the opening is curved.
Claims20
A device comprising:
- a die comprising:
- a semiconductor substrate comprising an arched bottom surface;
- a plurality of dielectric layers over the semiconductor substrate;
- a plurality of metal lines and vias in the plurality of dielectric layers;
- and
- a plurality of conductive pipes penetrating through the plurality of dielectric layers and the semiconductor substrate, wherein bottoms of the plurality of conductive pipes extend to the arched bottom surface, and wherein the plurality of conductive pipes have different lengths.
A device comprising:
- a semiconductor substrate;
- a bonding layer underlying and contacting the semiconductor substrate;
- a supporting substrate underlying and contacting the bonding layer;
- an opening extending from a first bottom surface of the supporting substrate upwardly to penetrate through the bonding layer, wherein the opening further extends into the semiconductor substrate, and wherein a second bottom surface of a portion of the semiconductor substrate facing the opening is continuously curved, with middle portions of the second bottom surface increasingly higher than edge portions of the second bottom surface;
- a plurality of dielectric layers over the semiconductor substrate;
- and
- integrated circuit devices at a surface of the semiconductor substrate.
A device comprising:
- a device die comprising:
- a semiconductor substrate;
- and
- a plurality of dielectric layers over the semiconductor substrate, wherein portions of the semiconductor substrate and the plurality of dielectric layers form a membrane configured to vibrate, and wherein edge portions of the membrane are increasingly thicker than middle portions of the membrane;
- a bonding layer underlying and bonded to the semiconductor substrate;
- and
- a supporting substrate underlying and bonded to the bonding layer, wherein an opening is directly underlying the membrane, and extends into the semiconductor substrate and penetrates through the bonding layer and the supporting substrate.
Dependencies are inferred from the claim text.