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US 12,207,417 B2Granted
Three-dimensional circuit board processing apparatus
AssigneeSimetric Semiconductor Solutions Co., Ltd.
InventorsMarcus Elmar Lang, Kei Ming Yip
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AssigneeSimetric Semiconductor Solutions Co., Ltd.
InventorsMarcus Elmar Lang, Kei Ming Yip
Estimating the term…
The present invention discloses a three-dimensional circuit board processing apparatus, including an input module, a vertical processing module, and an output module, which are arranged in sequence. The vertical processing module includes a conveying unit and a processing assembly. A vertical conveying port is arranged on each of two sides of the vertical processing module. The input module is connected to one end of the conveying unit, and the output module is connected to another end of the conveying unit. The input module and/or the output module are/is a flippable module. According to embodiments of the present invention, by arranging the flippable input module and/or output module, the circuit board may enter and exit the vertical processing module vertically, and may be uniformly processed through the vertical processing module, thereby enhancing the processing quality of the circuit board and improving the automation performance of three-dimensional processing.
A three-dimensional circuit board processing apparatus, comprising an input module configured to input a circuit board, a vertical processing module, and an output module configured to output the circuit board, which are arranged in sequence, the vertical processing module comprises a conveying unit configured to vertically convey the circuit board and a processing assembly configured to process the circuit board;
Dependencies are inferred from the claim text.