Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit package

An integrated ceramic resonator, comprising:

• a ceramic substrate having an upper planar surface for receiving a surface-mounted integrated circuit package;
• a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate;
• a conductive rod extending vertically at least partially into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity;
• a first via structure disposed vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package;
• and
• a second via structure disposed through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.

A method for manufacturing an integrated device, comprising:

• forming a plurality of planar ceramic layers wherein one or more of the plurality of planar ceramic layers include corresponding patterned metal layers;
• aligning the plurality of planar ceramic layers and corresponding patterned metal layers to overlie one another;
• and
• fusing the plurality of planar ceramic layers and the corresponding patterned metal layers with one another in a thermal process to form an integrated ceramic resonator having
• an upper planar surface for receiving a surface-mounted integrated circuit package,
• a plurality of conductive walls defining a conductive periphery of a ceramic cavity,
• a conductive rod extending vertically at least partially into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity,
• a first via structure extending vertically through the upper planar surface for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package, and
• a second via structure extending vertically through the upper planar surface for connecting the conductive rod to the surface-mounted integrated circuit package.