Process tool for analyzing bonded workpiece interface

A method, comprising:

• determining a position of an interface between a pair of bonded workpieces;
• generating a first beam of electromagnetic radiation that is directed toward a perimeter of the interface between the pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the interface;
• measuring, with the radiation sensor, a first intensity of the first beam of electromagnetic radiation that impinges on the radiation sensor;
• depositing an underfill at the interface between the pair of bonded workpieces;
• generating a second beam of electromagnetic radiation that is directed toward the perimeter of the interface between the pair of bonded workpieces and toward the radiation sensor that is arranged behind the perimeter of the interface;
• measuring, with the radiation sensor, a second intensity of the second beam of electromagnetic radiation that impinges on the radiation sensor;
• and
• determining a volume of the underfill based on a difference between the second intensity and the first intensity.

A method comprising:

• determining a position of an interface between a pair of bonded workpieces;
• depositing an underfill along the interface between the pair of bonded workpieces;
• generating, with a radiation source, a first beam of electromagnetic radiation that is directed toward a perimeter of the interface between the pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the interface, the first beam having a first beam size;
• measuring, with the radiation sensor, a first intensity of the first beam of electromagnetic radiation that impinges on the radiation sensor;
• generating, with the radiation source, a second beam of electromagnetic radiation that is directed toward the perimeter of the interface between the pair of bonded workpieces and toward the radiation sensor that is arranged behind the perimeter of the interface, the second beam having a second beam size different than the first beam size;
• measuring, with the radiation sensor, a second intensity of the second beam of electromagnetic radiation that impinges on the radiation sensor;
• and
• determining, with sensor control circuitry, a position of the underfill relative to the position of the interface between the pair of bonded workpieces based on the first intensity and the second intensity.