Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modules

A chiplet-based multi-chip module (MCM) to couple to a base substrate, comprising:

• a package substrate that is separate from the base substrate;
• a host integrated circuit (IC) chiplet coupled to the package substrate and comprising:
• at least one processing element;
• a first die-to-die (D2D) interface of a first type to transfer memory information from the at least one processing element via a communications fabric;
• a memory chiplet comprising:
• a second D2D interface of the first type coupled to the first D2D interface via multiple lanes, the second D2D interface organized into multiple unit interface modules, each of the multiple unit interface modules corresponding to a first set of signal path resources of a lowest granularity provided by the multiple lanes;
• a memory port comprising a memory physical interface of a first memory type to access memory storage of the first memory type, the memory physical interface of the first memory type comprising a second set of signal path resources corresponding to multiple memory channels of a first memory type;
• and
• mapping circuitry to map the second set of signal path resources to the first set of signal path resources in a manner that utilizes all of the first set of signal path resources for an integer number of the multiple unit interface modules.