Honeycomb structure and manufacturing method of the same
AssigneeNGK Insulators, Ltd.
InventorHiroaki Suzuki
Life of this patent
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Abstract
A honeycomb structure includes a pillar-shaped honeycomb structure body having a porous partition wall so as to surround a plurality of cells extending from a first end face to a second end face, and a circumferential coating layer composed of a circumferential coating material coated on at least a part of circumference of the honeycomb structure body, wherein the circumferential coating layer has a printing area for printing on the surface thereof, the printing area has a lightness (L*) in L*a*b* color space (CIE1976) defined by International Commission on Illumination (CIE) of 35 or more, and the printing area has a surface roughness Ra of 30 μm or less.
Claims11
A honeycomb structure, comprising:
- a pillar-shaped honeycomb structure body having a porous partition wall so as to surround a plurality of cells extending from a first end face to a second end face, and
- a circumferential coating layer composed of a circumferential coating material coated on at least a part of circumference of the honeycomb structure body, wherein
- the circumferential coating layer has a printing area for printing on the surface thereof,
- at a part constituting the printing area of the circumferential coating layer (i) a content ratio of each of silicon carbide and aluminum oxide is 20% by mass or more, and (ii) a content ratio of titanium oxide is 5% by mass to 15% by mass, with respect to 100% by mass of the constituent components of the part, and silicon carbide is a component having the highest content ratio at the part constituting the printing area,
- the printing area has a lightness (L*) in L*a*b* color space (CIE1976) defined by International Commission on Illumination (CIE) of 35 or more, and
- the printing area has a surface roughness (Ra) of 30 μm or less.
Dependencies are inferred from the claim text.