Cryostat device for superconducting magnetic levitation train and operation method thereof

A cryostat device for a superconducting magnetic levitation train, comprising:

• a conduction assembly;
• a support assembly;
• and
• a refrigeration assembly;
• wherein the conduction assembly comprises a conduction shell, a copper box, and a thermally-conductive support rod assembly;
• the copper box is arranged in the conduction shell;
• a top of the thermally-conductive support rod assembly is fixedly connected with a bottom of the copper box, and a bottom of the thermally-conductive support rod assembly is fixedly connected with a bottom wall of the conduction shell;
• a top of the copper box is provided with a superconducting bulk accommodating cavity, and the bottom of the copper box is provided with a cooling energy connecting end;
• a top of the support assembly is configured to support the conduction assembly, and a bottom of the support assembly is configured to be connected with a bogie chassis of the superconducting magnetic levitation train;
• the refrigeration assembly is provided with a cooling energy input end, and the cooling energy input end is connected with the cooling energy connecting end;
• the cooling energy input end is configured as a cold finger conduction column;
• the refrigeration assembly is further provided with a cold finger mounting base;
• the cold finger conduction column is provided on the cold finger mounting base, and a bottom of the cold finger mounting base is configured as a reference plane;
• a vertical distance between a top of the cold finger conduction column and the reference plane is represented as a first vertical distance, and a vertical distance between a top of the cold finger mounting base and the reference plane is represented as a second vertical distance;
• and the first vertical distance is larger than the second vertical distance;
• and
• the cooling energy connecting end is configured as a mounting cylinder;
• an outer wall of the cold finger mounting base is configured to be clamped in the mounting cylinder to form a conduction cooling cavity in the mounting cylinder;
• and the top of the cold finger conduction column is configured to be in contact with the bottom of the copper box in the conduction cooling cavity.