System and method for chemical mechanical polishing pad replacement

A chemical mechanical polishing (CMP) pad replacement system comprising:

• a pad tape replacement module configured to removably engage a first and second rotatable platen of an associated CMP processing tool,
• the CMP processing tool comprising:
• a rotatable platen carrier including the first rotatable platen and the second rotatable platen,
• a first CMP pad affixed to the first rotatable platen,
• a pad wear detection module configured to output a state of the first CMP pad affixed to the first rotatable platen, and
• a pad tearer tool configured to rotate and engage the first rotatable platen to remove the first CMP pad therefrom;
• the pad tape replacement module comprising:
• a pad tape supply roller storing pad tape,
• at least one backing removal roller,
• a backing recycle roller,
• a pressure roller, and
• a pad tape recycle roller;
• and
• a CMP tool controller in data communication with the pad tape replacement module and the CMP processing tool, and the CMP tool controller including a processor in communication with a memory, wherein the memory stores instructions which are executed by the processor causing the processor to:
• receive an output from a wear detection sensor operatively associated with the pad wear detection module corresponding to a state of the first CMP pad on the first rotatable platen of the rotatable platen carrier;
• using an operatively connected first motor to position the pad tape replacement module proximate to the first rotatable platen responsive to an output of the pad wear detection module;
• using an operatively connected second motor to rotate the rotatable platen carrier toward the pad tearer tool movably positioned adjacent to the rotatable platen carrier;
• using an operatively connected third motor to engage the pad tearer tool to remove the first CMP pad affixed to the first rotatable platen;
• and
• roll, via the pressure roller, a second CMP pad disposed in the pad tape onto the second rotatable platen of the rotatable platen carrier.

A chemical mechanical polishing (CMP) device, comprising:

• a platen carrier positioned within an interior chamber of the CMP device and comprising
• a plurality of independently rotatable platens coupled thereto;
• a plurality of polishing pads correspondingly affixed to each of the independently rotatable platens;
• a rotation motor coupled to a central shaft of the platen carrier and configured to rotate the platen carrier;
• a platen rotation motor removably coupled to at least one platen, the platen rotation motor
• configured to rotate the at least one platen during chemical mechanical polishing operation;
• and
• a pad tearer tool positioned within the chamber, the pad tearer tool configured to rotate and engage one of the platens to remove a pad therefrom.