Circuit board with polymer conductive members

A circuit board, comprising:

• a first insulating layer;
• an insulating substrate layer;
• a first ground layer disposed between the first insulating layer and the insulating substrate layer, and the first ground layer comprising at least one first film-liked metal ground layer;
• a first signal transmission layer disposed at one side of the first insulating layer opposite to the insulating substrate layer, and the first signal transmission layer comprising a plurality of first film-liked metal signal layers;
• a plurality of insulating through holes, each of the insulating through holes penetrating through the first signal transmission layer and the first insulation layer to connect to the first ground layer;
• and
• a plurality of polymer conductive members respectively disposed within the insulating through holes, each of the polymer conductive members comprises a first portion and a second portion which are perpendicularly connected to each other,
• wherein the first portion transversely extends in the first insulating layer, and is electrically connected to the at least one first film-liked metal ground layer, and the second portion extends longitudinally through the first insulating layer and the first signal transmission layer.