Solar cell, photovoltaic module, and method for manufacturing photovoltaic module

A photovoltaic module, comprising glass, a first packaging adhesive film, a solar cell string, a second packaging adhesive film, and a back sheet arranged successively along a thickness direction, wherein the solar cell string comprises solar cells and solder strips configured to connect adjacent solar cells;

• the solar cells each comprise:
• a substrate;
• first busbars and second busbars arranged on the substrate and extending along a first direction (X), wherein the first busbars and the second busbars are arranged alternately along a second direction (Y) intersecting with the first direction (X), and the first busbars and the second busbars have opposite polarities;
• first fingers and second fingers arranged on the substrate and extending along the second direction (Y), wherein the first fingers and the second fingers are arranged alternately along the first direction (X), the first fingers are connected to the first busbars, the second fingers are connected to the second busbars, the first fingers have a same polarity as the first busbars, and the second fingers have a same polarity as the second busbars;
• and
• busbar pits provided on the substrate and spaced apart along the second direction (Y), wherein at least part of the first busbars and at least part of the second busbars are located in the busbar pits,
• wherein, along a thickness direction of the substrate, each of the busbar pits has a first depth h1 which satisfies:
• 30 μm≤h1≤50 μm,
• wherein along the thickness direction of the substrate, a ratio of the first depth h1 of each of the busbar pits to at least one of heights of the first busbars or heights of the second busbars are in a range from 10:3 to 6:5,
• wherein the solder strips are respectively connected to the first busbars and the second busbars on the adjacent solar cells, and along a thickness direction of the solar cells, the solder strips are arranged on sides of the first busbars and the second busbars away from the substrate, and at least part of the solder strips are located in the busbar pits, and
• wherein 15% to 25% of the solder strips are located in the busbar pits.