Wiring base, package for storing semiconductor element, and semiconductor device
AssigneeKYOCERA Corporation
InventorsMakoto Yamamoto, Junichi Minagoe
Life of this patent
Estimating the term…
Abstract
A wiring base includes a base having a first surface, at least one metal layer positioned on the first surface, at least one lead terminal positioned on the metal layer, and a joining member that is positioned on the metal layer and joins the lead terminal to the metal layer. The lead terminal has a first portion to be in contact with the joining member and also has a second portion being continuous with the first portion. In a cross section of the lead terminal orthogonal to a longitudinal direction of the lead terminal, the first portion has two concave surfaces that are formed near the metal layer so as to be disposed opposite to each other across a center in a transverse direction of the lead terminal.
Claims8
A wiring base, comprising:
- a base having a first surface;
- at least one metal layer positioned on the first surface;
- at least one lead terminal positioned on the metal layer;
- and
- a joining member that is positioned on the metal layer and joins the lead terminal to the metal layer, wherein
- the lead terminal has a first portion to be in contact with the joining member and a second portion being continuous with the first portion, and
- in a cross section of the lead terminal orthogonal to a longitudinal direction of the lead terminal, the first portion has two concave surfaces that are formed near the metal layer so as to be disposed opposite to each other across a center in a transverse direction of the lead terminal.
Dependencies are inferred from the claim text.