Member for semiconductor manufacturing apparatus, method for manufacturing the same, and mold

A member for a semiconductor manufacturing apparatus comprising a ceramic disc incorporating an electrode and a ceramic cylindrical shaft supporting the disc,

• wherein the disc and the shaft are integrally formed and mutually have no bonding interface,
• the disc has a surface with which the shaft is integrated, the surface having a region inside the shaft and a region outside the shaft,
• the region inside the shaft is recessed by one step with respect to the region outside the shaft and has an electrode exposure hole through which the electrode is exposed,
• the shaft has an inner space including a first space extending from a position at a predetermined height with respect to the region of the disc inside the shaft to the region of the disc inside the shaft, the first space having a frustoconical shape whose diameter increases from the position at the predetermined height toward the region of the disc inside the shaft, and
• the inner space of the shaft includes a second space extending from the position at the predetermined height to an opening of the shaft, the second space having a frustoconical shape whose diameter increases from the position at the predetermined height toward the opening of the shaft.