Module tray for semiconductor device

A module tray for a semiconductor device, the module tray comprising:

• a case having an accommodation space to accommodate semiconductor substrates, the case including:
• a base plate,
• a first sidewall and a second sidewall extending in a vertical direction from opposite sides of the base plate to define the accommodation space,
• a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls to separate the accommodation space,
• first to fourth fastening guides on opposite side surfaces of the dividing wall and inner surfaces of the first and second sidewalls, respectively, the first to fourth fastening guides extending in the vertical direction to accommodate opposite ends of respective ones of the semiconductor substrates, and the first to fourth fastening guides respectively having first to fourth fastening grooves that gradually widen toward their respective tops;
• and
• first to fourth guide grooves on the opposite side surfaces of the dividing wall and the inner surfaces of the first and second sidewalls, the first to fourth guide grooves having curved concave shapes to guide the semiconductor substrates into the first to fourth fastening guides, respectively;
• and
• a cover detachably fastened on the case to cover the accommodation space.

A module tray for semiconductor device, the module tray comprising:

• a case having an accommodation space configured to accommodate semiconductor substrates, the case including:
• a base plate,
• a first sidewall and a second sidewall extending in a vertical direction from the base plate, the first and second sidewalls having respective first and second guide grooves with curved concave shapes on upper surfaces thereof to guide the semiconductor substrates into the accommodation space,
• a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls to separate the accommodation space, the dividing wall having third and fourth guide grooves with curved concave shapes on upper surface thereof to guide the semiconductor substrates into the accommodation space, respectively, and
• first to fourth fastening guides on opposite surfaces of the dividing wall and inner surfaces of the first and second sidewalls, respectively, the first to fourth fastening guides extending in the vertical direction to accommodate opposite ends of each of the semiconductor substrates, the first to fourth fastening guides respectively having first to fourth fastening grooves that gradually widen toward tops thereof,
• wherein the first sidewall includes a first number of first reinforcing grooves on an outer surface of the first sidewall, and first fixing grooves,
• wherein the second sidewall includes a second number of second reinforcing grooves on an outer surface of the second sidewall, and second fixing grooves, the second number being different from the first number;
• and
• a cover detachably fastened on the case to cover the accommodation space, the cover including:
• first and second fixing protrusions protruding from an inner surface thereof and fastened to the first and second fixing grooves, respectively;
• a first intaglio on an upper surface along a label attachment area,
• second intaglios on respective corners of a peripheral area that surrounds the label attachment area, and
• a support portion protruding from a surface of the cover to contact the dividing wall, a height of the support portion being equal to a height difference between the dividing wall and each of the first and second sidewalls from the base plate.