Exposure system and method for manufacturing electronic devices

A method for manufacturing electronic devices, the method comprising performing scan exposure on a light sensitive substrate with a reticle irradiated with pulsed laser light to manufacture the electronic devices by using an exposure system including

• a laser apparatus configured to output the pulsed laser light,
• an illumination optical system configured to guide the pulsed laser light to the reticle,
• a reticle stage configured to move the reticle, and
• a processor configured to control the output of the pulsed laser light from the laser apparatus and the movement of the reticle performed by the reticle stage,
• the reticle having a first region where a first pattern is disposed and a second region where a second pattern is disposed,
• the first and second regions each being a region continuous in a scan width direction perpendicular to a scan direction of the pulsed laser light, the first and second regions arranged side by side in the scan direction, and
• the processor configured to control the laser apparatus to output the pulsed laser light according to each of the first and second regions by changing values of control parameters of the pulsed laser light in accordance with each of the first and second regions,
• wherein let a Y-axis direction be the scan direction, and a width By be a Y-axis-direction beam width of a scan beam of the pulsed laser light that scans the reticle toward the positive side of the Y-axis direction,
• the processor is configured to
• based on information on a reticle pattern of the reticle, determine an enlarged region by changing a Y-axis-direction-negative-side boundary of the first region toward the negative side of the Y-axis direction by a distance corresponding to the width By to enlarge the first region, and determine a reduced region by changing a Y-axis-direction-positive-side boundary of the second region adjacent to a Y-axis-direction-positive side of the first region toward the negative side of the Y-axis direction by the distance corresponding to the width By to reduce the second region, and
• control the laser apparatus to output the pulsed laser light according to each of the enlarged region and the reduced region by changing the values of the control parameters of the pulsed laser light in accordance with each of the enlarged region and the reduced region.