Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer
AssigneeIntel Corporation
InventorsAbhishek A. Sharma, Wilfred Gomes
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Abstract
Described herein are stacked photonic integrated circuit (PIC) assemblies that include multiple layers of waveguides. The waveguides are formed of substantially monocrystalline materials, which cannot be repeatedly deposited. Layers of monocrystalline material are fabricated and repeatedly transferred onto the PIC structure using a layer transfer process, which involves bonding a monocrystalline material using a non-monocrystalline bonding material. Layers of isolation materials are also deposited or layer transferred onto the PIC assembly.
Claims20
An integrated circuit (IC) assembly, comprising:
- a first optical layer comprising a first waveguide formed of a substantially monocrystalline material, the first optical layer having a front face;
- a second optical layer comprising a second waveguide, the second optical layer having a back face;
- and
- a bonding layer between the front face of the first optical layer and the back face of the second optical layer, the bonding layer comprising a bonding material having a lower crystallinity than the first waveguide.
An integrated circuit (IC) assembly, comprising:
- a first optical layer comprising a first optical waveguide, the first optical waveguide formed from a first crystalline material having a grain size of at least 20 nanometers;
- a second optical layer comprising a second optical waveguide, second optical waveguide formed from a second crystalline material having a grain size of at least 20 nanometers;
- and
- a bonding layer between the first optical layer and the second optical layer, the bonding layer comprising a bonding material having a lower crystallinity than the first optical waveguide and the second optical waveguide.
A method comprising:
- implanting an upper portion of a waveguide material with an implant material, the waveguide material having an upper face and a lower face, wherein the waveguide material is a substantially monocrystalline material;
- attaching the upper face of the waveguide material to a carrier structure;
- bonding the lower face of the waveguide material to a support layer with a bonding material, the bonding material comprising an amorphous or polycrystalline material;
- removing the upper portion of the waveguide material and the carrier structure;
- and
- forming at least one optical waveguide in the waveguide material.
Dependencies are inferred from the claim text.