Adaptive baking method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTzung-Chen Wu, Heng-Jen Lee, Ho-Yung David Hwang, Wen-Zhan Zhou
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Abstract
A controller includes a non-transitory computer readable medium configured to store information related to a target temperature of a wafer, a target temperature of a heating element, a temperature of the wafer, and a temperature of the heating element. The controller further includes a processor connected to the non-transitory computer readable medium, the processor configured to generate at least one heating signal during a baking process to adjust a duration of an entirety of the baking process in response to the temperature of the wafer and the temperature of the heating element.
Claims20
A method comprising:
- performing a baking process on an entirety of water, wherein the baking process comprises heating the wafer for a first duration using a heating element;
- measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information related to both the heating element and the wafer;
- and
- decreasing, during the first duration, an amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.
A method comprising:
- performing a baking process on an entirety of a water, wherein the baking process comprises heating the wafer for a first duration using a heating element;
- measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information related to both the heating element and the wafer;
- and
- increasing a duration of the baking process beyond the first duration in response to the temperature information.
A method comprising:
- performing a baking process on an entirety of a wafer, wherein the baking process comprises heating the wafer for a first duration using a heating element, and the heating element comprises a plurality of heating zones;
- measuring a temperature of at least one of the plurality of heating zones of the heating element and a temperature of the wafer during the first duration to obtain temperature information related to both the heating element and the wafer;
- and
- at least one of:
- increasing a duration of the baking process beyond the first duration in response to the temperature information;
- or
- decreasing, during the first duration, an amount of heat provided by the at least one zone of the plurality of heating zones of the heating element as a rate of change of the temperature information versus time increases.
Dependencies are inferred from the claim text.