Plating membrane

A plating membrane, comprising:

• a support structure comprising:
• support members connected to and extending radially outward from a nozzle located at a center of the plating membrane;
• and
• a frame, supported by the support structure, having an inner wall that is angled radially outward from the nozzle, wherein the frame is configured to:
• eliminate redirection of a plating solution, dispensed from the nozzle, inward toward the center of the plating membrane,
• wherein the inner wall extends from a lower surface of the frame to an upper surface of the frame, and
• wherein the inner wall extends along an inner circumference of the frame.

A plating tool, comprising:

• a nozzle configured to direct a flow of a plating solution toward a wafer;
• and
• a plating membrane, comprising:
• a support structure connected to and extending radially outward from the nozzle;
• and
• a frame, attached to and supported by the support structure, having an inner wall that is angled outward from the nozzle,
• wherein an angle of the inner wall is configured to eliminate redirection of the plating solution by the inner wall inward toward a center of the plating membrane, and
• wherein the inner wall extends from a bottom surface of the frame to a top surface of the frame.