# US 12,193,293 B2 · Display panel and manufacturing method thereof, and terminal device

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- Number: US 12,193,293 B2
- Document ID: US12193293B2
- Status: Granted
- Kind: B2
- Application number: 18/007,854
- Filed: 2022-09-09
- Published: 2024-04-18
- Granted: 2025-01-07
- Earliest claimed: 2021-11-29
- Assignees: Honor Device Co., Ltd.
- Applicants: Honor Device Co., Ltd.
- Inventors: Yabin An; Wei Qu; Feng Zhang
- Web page: https://patentgrep.com/patent/US12193293B2

## CPC

- G02F 1/133305: {Flexible substrates, e.g. plastics, organic film}
- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- G02F 1/133302: {Rigid substrates, e.g. inorganic substrates}
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- H10K 59/1201: {Manufacture or treatment}
- H10K 59/124: Insulating layers formed between TFT elements and OLED elements
- Y02E 10/549: Organic PV cells
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

Embodiments of this application provide a display panel and a manufacturing method thereof, and a terminal device, which are applied to the field of terminal technologies. The display panel includes a rigid substrate, a driving circuit layer arranged on the rigid substrate, and a first organic layer structure, a conductive layer, and a second organic layer structure that are sequentially arranged away from the rigid substrate, where the rigid substrate and the driving circuit layer are arranged bypassing a bendable region, and first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least a first peripheral region, the bendable region, and a binding region.

## Claims

### Claim 1

A display panel, comprising:
a display region;
a bezel region surrounding the display region, wherein the bezel region comprises a first peripheral region, a bendable region, and a binding region, wherein the first peripheral region, the bendable region, and the binding region are sequentially arranged away from the display region, and wherein the binding region is bent to a backlight side of the display panel through the bendable region;
a rigid substrate having a driving circuit layer arranged directly thereon, wherein the rigid substrate and the driving circuit layer are arranged bypassing the bendable region; and
a first organic layer structure, a conductive layer, and a second organic layer structure that are sequentially arranged away from the rigid substrate, wherein the first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least the first peripheral region, the bendable region, and the binding region, and wherein the first organic layer structure in the first peripheral region is located on a side of the driving circuit layer away from the rigid substrate.

### Claim 2 (depends on 1)

The display panel of claim 1, further comprising a first inorganic layer structure arranged between the first organic layer structure and the conductive layer, wherein the first inorganic layer structure comprises at least one inorganic layer and is distributed in at least the first peripheral region, the bendable region, and the binding region.

### Claim 3 (depends on 2)

The display panel of claim 2, wherein the bezel region further comprises a second peripheral region, a third peripheral region, and a fourth peripheral region, wherein the first peripheral region and the third peripheral region are located on two opposing sides of the display region, both the second peripheral region and the fourth peripheral region are located between the first peripheral region and the third peripheral region, and the second peripheral region and the fourth peripheral region are also located on the two opposing sides of the display region, and wherein the first organic layer structure and the first inorganic layer structure are further distributed in the display region, the second peripheral region, the third peripheral region, and the fourth peripheral region.

### Claim 4 (depends on 2)

The display panel of claim 2, wherein the conductive layer comprises a plurality of connection leads, and wherein one end of each of the connection leads is connected to a signal line in the driving circuit layer through a first via running through the first inorganic layer structure and the first organic layer structure, and another end of each of the connection leads is connected to a driver chip arranged in the binding region through a second via running through the second organic layer structure.

### Claim 5 (depends on 4)

The display panel of claim 4, wherein the display panel is a liquid crystal display (LCD) display panel, and the conductive layer and the second organic layer structure are arranged bypassing the display region, and wherein the signal line further extends to the first peripheral region, and the first via is located in the first peripheral region.

### Claim 6 (depends on 4)

The display panel of claim 4, wherein the display panel is an organic light-emitting diode (OLED) display panel, and the conductive layer and the second organic layer structure are further distributed in the display region, and wherein the signal line further extends to the first peripheral region, and the first via is located in the first peripheral region or the first via is located in the display region.

### Claim 7 (depends on 6)

The display panel of claim 6, wherein the bezel region further comprises a second peripheral region, a third peripheral region, and a fourth peripheral region, wherein the first peripheral region and the third peripheral region are located on two opposing sides of the display region, both the second peripheral region and the fourth peripheral region are located between the first peripheral region and the third peripheral region, and the second peripheral region and the fourth peripheral region are also located on the two opposing sides of the display region, and wherein the conductive layer and the second organic layer structure are further distributed in the second peripheral region, the third peripheral region, and the fourth peripheral region.

### Claim 8 (depends on 6)

The display panel of claim 6, further comprising:
an anode layer distributed in the display region and located on a side of the second organic layer structure away from the rigid substrate; and
a pixel defining layer distributed in at least the display region, the first peripheral region, the bendable region, and the binding region, and located on a side of the second organic layer structure away from the first organic layer structure.

### Claim 9 (depends on 1)

The display panel of claim 1, wherein the first organic layer structure and the second organic layer structure each comprise at least one organic layer.

### Claim 10 (depends on 9)

The display panel of claim 9, wherein the first organic layer structure comprises a plurality of organic layers, and the display panel further comprises a second inorganic layer structure arranged between two adjacent organic layers, and wherein the second inorganic layer structure comprises at least one inorganic layer, and is distributed in at least the first peripheral region, the bendable region, and the binding region.

### Claim 11 (depends on 1)

The display panel of claim 1, further comprising an adhesive layer located between the rigid substrate in the binding region and the rigid substrate in the display region.

### Claim 12

A manufacturing method for a display panel, comprising:
providing a rigid substrate, wherein the rigid substrate is divided into a display region and a bezel region surrounding the display region, the bezel region comprises a first peripheral region, a bendable region, and a binding region, and wherein the first peripheral region, the bendable region, and the binding region are sequentially arranged away from the display region;
forming a driving circuit layer directly on the rigid substrate;
sequentially forming a first organic layer structure, a conductive layer, and a second organic layer structure on the driving circuit layer, wherein the first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least the first peripheral region, the bendable region, and the binding region;
peeling off the rigid substrate and the driving circuit layer in the bendable region; and
bending the bendable region toward a backlight side of the display panel, so that the binding region is bent to the backlight side of the display panel.

### Claim 13 (depends on 12)

The method of claim 12, wherein peeling off the rigid substrate and the driving circuit layer in the bendable region comprises performing laser irradiation on a side of the rigid substrate away from the driving circuit layer by using a light-shielding fixture, to peel off the rigid substrate and the driving circuit layer in the bendable region, wherein the light-shielding fixture comprises a light-shielding region and a light-transmitting region, the light-transmitting region is arranged corresponding to the bendable region, and the light-shielding region is arranged corresponding to a region other than the bendable region.

### Claim 14 (depends on 12)

The method of claim 12, wherein before bending the bendable region toward the backlight side of the display panel, the method further comprises arranging an adhesive layer on either a) a surface at a side of the rigid substrate in the display region away from the first organic layer structure, or b) a surface at a side of the rigid substrate in the binding region away from the first organic layer structure,
wherein after bending the bendable region toward the backlight side of the display panel, the method further comprises adhering the rigid substrate in the binding region to the rigid substrate in the display region through the adhesive layer.

### Claim 15

A display panel, comprising:
a display region;
a bezel region surrounding the display region, wherein the bezel region comprises a first peripheral region, a bendable region, and a binding region, wherein the first peripheral region, the bendable region, and the binding region are sequentially arranged away from the display region, and wherein the binding region is bent to a backlight side of the display panel through the bendable region;
a rigid substrate having a driving circuit layer arranged directly thereon, wherein the rigid substrate and the driving circuit layer are arranged bypassing the bendable region;
a first organic layer structure, a conductive layer, and a second organic layer structure that are sequentially arranged away from the rigid substrate, wherein the first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least the first peripheral region, the bendable region, and the binding region, wherein the first organic layer structure in the first peripheral region is located on a side of the driving circuit layer away from the rigid substrate, and wherein the conductive layer comprises a plurality of connection leads; and
a first inorganic layer structure arranged between the first organic layer structure and the conductive layer, wherein the first inorganic layer structure comprises at least one inorganic layer and is distributed in at least the first peripheral region, the bendable region, and the binding region, and wherein a material of the inorganic layer is silicon nitride or silicon oxide.

### Claim 16 (depends on 15)

The display panel of claim 15, wherein the bezel region further comprises a second peripheral region, a third peripheral region, and a fourth peripheral region, wherein the first peripheral region and the third peripheral region are located on two opposing sides of the display region, both the second peripheral region and the fourth peripheral region are located between the first peripheral region and the third peripheral region, and the second peripheral region and the fourth peripheral region are also located on the two opposing sides of the display region, and wherein the first organic layer structure and the first inorganic layer structure are further distributed in the display region, the second peripheral region, the third peripheral region, and the fourth peripheral region.

### Claim 17 (depends on 15)

The display panel of claim 15, wherein one end of each of the connection leads is connected to a signal line in the driving circuit layer through a first via running through the first inorganic layer structure and the first organic layer structure, and another end of each of the connection leads is further connected to a driver chip arranged in the binding region through a second via running through the second organic layer structure.

### Claim 18 (depends on 17)

The display panel of claim 17, wherein the display panel is a liquid crystal display (LCD) display panel, and the conductive layer and the second organic layer structure are arranged bypassing the display region, and wherein the signal line further extends to the first peripheral region, and the first via is located in the first peripheral region.

### Claim 19 (depends on 17)

The display panel of claim 17, wherein the display panel is an organic light-emitting diode (OLED) display panel, and the conductive layer and the second organic layer structure are further distributed in the display region, and wherein the signal line further extends to the first peripheral region, and the first via is located in the first peripheral region or the first via is located in the display region.

### Claim 20 (depends on 19)

The display panel of claim 19, wherein the bezel region further comprises a second peripheral region, a third peripheral region, and a fourth peripheral region, wherein the first peripheral region and the third peripheral region are located on two opposing sides of the display region, both the second peripheral region and the fourth peripheral region are located between the first peripheral region and the third peripheral region, and the second peripheral region and the fourth peripheral region are also located on the two opposing sides of the display region, and wherein the conductive layer and the second organic layer structure are further distributed in the second peripheral region, the third peripheral region, and the fourth peripheral region.