# US 12,193,203 B2 · Damping film and process for producing a damping film > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,203 B2 - Document ID: US12193203B2 - Status: Granted - Kind: B2 - Application number: 18/288,232 - Filed: 2022-04-29 - Published: 2024-07-18 - Granted: 2025-01-07 - Earliest claimed: 2021-04-30 - Assignees: Magnetec Corporation - Applicants: Magnetec GmbH - Inventors: Thomas Wentzlik - Web page: https://patentgrep.com/patent/US12193203B2 ## CPC - H05K 9/0086: {comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering} - H05K 9/0075: {Magnetic shielding materials} - H05K 9/0088: {comprising a plurality of shielding layers; combining different shielding material structure} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A damping film for shielding an electronic device from an electrical and/or magnetic field, in particular damping film for shielding an electronic device having components for wireless charging from an electrical and/or magnetic field, comprising a first carrier layer, a first adhesion layer which is in direct contact with the first carrier layer, a damping layer which is in direct contact with the first adhesion layer, wherein the damping layer comprises a damping material consisting of a magnetically soft substance, a second adhesion layer which is in direct contact with the damping layer, in particular is in direct contact with the damping layer on the side facing away from the first adhesion layer, and a second carrier layer which is in direct contact with the second adhesion layer. ## Claims ### Claim 1 A damping film for shielding an electronic device from an electrical and/or magnetic field comprising: a first carrier layer; a first adhesion layer which is in direct contact with the first carrier layer; a damping layer which is in direct contact with the first adhesion layer, wherein the damping layer comprises a damping material consisting of a magnetically soft substance; a second adhesion layer which is in direct contact with the damping layer; and a second carrier layer which is in direct contact with the second adhesion layer, wherein the damping material has a coercivity of less than or equal to 2 A/m. ### Claim 2 (depends on 1) The damping film according to claim 1, wherein the damping material of the damping layer projecting in the normal direction of the first carrier layer has a cross-sectional area of more than or equal to 80% of the cross-sectional area of the first carrier layer. ### Claim 3 (depends on 1) The damping film according to claim 1, wherein the damping layer comprises a layer of several strips of the damping material. ### Claim 4 (depends on 3) The damping film according to claim 3, wherein two strips of the damping material have a distance of less than or equal to 0.2 mm from each other. ### Claim 5 (depends on 3) The damping film according to claim 3, wherein two strips of the damping material overlap by more than or equal to 0.2 mm. ### Claim 6 (depends on 1) The damping film according to claim 1, wherein the damping layer comprises particles of the damping material. ### Claim 7 (depends on 6) The damping film according to claim 6, wherein the particles have an extension in a range of greater than or equal to 3 μm and less than or equal to 200 μm. ### Claim 8 (depends on 1) The damping film according to claim 1, wherein the damping film has a third adhesion layer. ### Claim 9 (depends on 1) The damping film according to claim 1, wherein the first carrier layer and/or the second carrier layer and/or the first adhesion layer and/or the second adhesion layer and/or the third adhesion layer has a temperature resistance of more than or equal to 80° C. ### Claim 10 (depends on 1) The damping film according to claim 1, wherein the damping material has a remanence of less than or equal to 0.1 T. ### Claim 11 (depends on 1) The damping film according to claim 1, wherein the damping material has a saturation flux density of greater than or equal to 1 T. ### Claim 12 (depends on 1) The damping film according to claim 1, wherein the magnetically soft substance is a metallic glass. ### Claim 13 (depends on 12) The damping film according to claim 12, wherein the magnetically soft substance has a nanocrystalline structure. ### Claim 14 (depends on 1) The damping film according to claim 1, wherein the magnetically soft substance has the following atomic composition: where a≤0.3, 0.6≤x≤1.5, 10≤y≤17, 5≤z≤14, 2≤a≤6, β≤7, and γ≤8, wherein M′ is at least one of the elements V, Cr, Co, Al and Zn, wherein M″ is at least one of the elements C, Ge, P, Ga, Sb, In and Be. ### Claim 15 (depends on 1) The damping film according to claim 1, wherein the magnetically soft substance has a magnetostriction with a relative change in length in terms of magnitude parallel to the magnetic field of less than or equal to 2 times 10−6. ### Claim 16 (depends on 1) An item comprising a battery, a receiver coil for wirelessly receiving energy, and a damping film according to claim 1. ### Claim 17 (depends on 16) The item according to claim 16, wherein the damping film is disposed between the battery and the receiver coil. ### Claim 18 (depends on 1) An item comprising a transmitter coil for wirelessly transmitting energy to a receiver coil, and a damping film according to claim 1. ### Claim 19 (depends on 18) The item according to claim 18, wherein the damping film is disposed on the transmitter coil. ### Claim 20 (depends on 1) A process for producing a damping film, comprising the following: providing a first carrier layer and a first adhesion layer; contacting the first carrier layer and the first adhesion layer; providing a damping material consisting of a magnetically soft substance; contacting the damping material with the first adhesion layer to form a damping layer connected to the first carrier layer; providing a second adhesion layer and a second carrier layer; contacting the second carrier layer and the second adhesion layer; and contacting the second adhesion layer with the damping layer to form a damping film according to claim 1. ### Claim 21 (depends on 1) A use of a damping film according to claim 1 in an item having components for wireless charging. ### Claim 22 (depends on 1) The use of a damping film according to claim 1 in an item having components to be shielded.