# US 12,193,199 B2 · Integrated capacitor cover > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,199 B2 - Document ID: US12193199B2 - Status: Granted - Kind: B2 - Application number: 17/960,386 - Filed: 2022-10-05 - Published: 2024-04-11 - Granted: 2025-01-07 - Earliest claimed: 2022-10-05 - Assignees: BorgWarner US Technologies LLC - Applicants: BorgWarner US Technologies LLC - Inventors: Yew Ming Chong - Web page: https://patentgrep.com/patent/US12193199B2 ## CPC - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - B60L 50/40: using propulsion power supplied by capacitors - H01G 9/08: Housing; Encapsulation - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B60L: PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES (arrangements or mounting of electrical propulsion units or of plural diverse prime-movers for mutual or common propulsion in vehicles B60K1/00, B60K6/20; arrangements or mounting of electrical gearing in vehicles B60K17/12, B60K17/14; preventing wheel slip by reducing power in rail vehicles B61C15/08; dynamo-electric machines H02K; control or regulation of electric motors H02P); SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES (electric coupling devices combined with mechanical couplings of vehicles B60D1/64; electric heating for vehicles B60H1/00); ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL (control or regulation of electric motors H02P); MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A system for an electric vehicle may include a housing, a cover configured to couple to the housing, the cover including an opening; a capacitor disposed within the housing, wherein the capacitor is mounted directly to the cover; and a heatsink disposed within or adjacent to the opening of the cover, wherein the heatsink is thermally connected to the capacitor. ## Claims ### Claim 1 A system for an electric vehicle, the system comprising: a housing; a cover configured to couple to the housing, the cover including an opening; a capacitor disposed between the housing and the cover, wherein the capacitor is mounted directly to the cover and exposed by the opening; and a heatsink disposed within or adjacent to the opening of the cover, wherein the heatsink is thermally connected to the capacitor. ### Claim 2 (depends on 1) The system of claim 1, further comprising: a printed circuit board (PCB) mounted to the housing, wherein the capacitor is not mounted directly to the PCB. ### Claim 3 (depends on 1) The system of claim 1, wherein the capacitor is a DC-link capacitor or a bulk capacitor. ### Claim 4 (depends on 1) The system of claim 1, wherein the capacitor is configured to connect to an electronic device of the electric vehicle, and wherein the electronic device is a control unit (ECU), an inverter, or a converter. ### Claim 5 (depends on 1) The system of claim 1, wherein the heatsink directly contacts the capacitor. ### Claim 6 (depends on 1) The system of claim 1, wherein the capacitor is not mounted directly to the housing. ### Claim 7 (depends on 1) The system of claim 1, wherein there is an obstruction-free path between the heatsink and the capacitor. ### Claim 8 An electric vehicle comprising: a housing; a cover configured to couple to the housing, the cover including an opening; a capacitor disposed between the housing and the cover, wherein the capacitor is mounted directly to the cover and exposed by the opening; and a heatsink disposed within or adjacent to the opening of the cover, wherein the heatsink is thermally connected to the capacitor. ### Claim 9 (depends on 8) The electric vehicle of claim 8, further comprising: a printed circuit board (PCB) provided in the housing, wherein the capacitor is not mounted directly to the PCB. ### Claim 10 (depends on 8) The electric vehicle of claim 8, wherein the capacitor is a DC-link capacitor or a bulk capacitor. ### Claim 11 (depends on 8) The electric vehicle of claim 8, wherein the capacitor is configured to connect to an electronic device of the electric vehicle, and wherein the electronic device is a control unit (ECU), an inverter, or a converter. ### Claim 12 (depends on 8) The electric vehicle of claim 8, wherein the heatsink is directly integrated with the capacitor. ### Claim 13 (depends on 8) The electric vehicle of claim 8, wherein the capacitor is not mounted directly to the housing. ### Claim 14 (depends on 8) The electric vehicle of claim 8, wherein an external surface of the heatsink is exposed directly to an external environment of the housing. ### Claim 15 A method of cooling a capacitor in an electrically-powered vehicle, the method comprising: cooling the capacitor by directing heat from an external surface of the capacitor to a heatsink disposed within or adjacent to an opening of a cover coupled to a housing, wherein the capacitor is between the cover and the housing, and the heatsink is at least partially external to the cover, wherein the heatsink includes one or more flanges that contact an inner surface of the cover, and wherein the heat from the heatsink is dissipated directly to an external environment of the housing. ### Claim 16 (depends on 15) The method of claim 15, wherein the heat is directed from the external surface of the capacitor directly to the heatsink. ### Claim 17 (depends on 15) The method of claim 15, wherein the heat is directed from the external surface of the capacitor through a thermal interface material. ### Claim 18 (depends on 15) The method of claim 15, wherein the capacitor is mounted directly to the cover of the housing, and wherein the capacitor is not mounted to the housing. ### Claim 19 (depends on 15) The method of claim 15, wherein the heatsink is exposed to the external environment of the housing. ### Claim 20 (depends on 15) The method of claim 15, wherein the capacitor directly contacts the heatsink.