# US 12,193,162 B2 · Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,162 B2 - Document ID: US12193162B2 - Status: Granted - Kind: B2 - Application number: 18/064,492 - Filed: 2022-12-12 - Published: 2023-04-06 - Granted: 2025-01-07 - Earliest claimed: 2021-06-04 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yoshihito Otsubo; Ryoichi Kita - Web page: https://patentgrep.com/patent/US12193162B2 ## CPC - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 1/181: associated with surface mounted components - H05K 1/113: {Via provided in pad; Pad over filled via} - H05K 9/00: Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/0341: Intermediate metal, e.g. before reinforcing of conductors by plating - H05K 2201/0715: provided by an outer layer of PCB - H05K 2201/09481: Via in pad; Pad over filled via - H05K 2201/09618: Via fence, i.e. one-dimensional array of vias - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10287: Metal wires as connectors or conductors - H05K 2201/10318: Surface mounted metallic pins - H05K 2201/10545: Related components mounted on both sides of the PCB - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H05K 2203/1316: Moulded encapsulation of mounted components - H05K 2203/1322: Encapsulation comprising more than one layer - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 44/248: {for antennas} - H10W 90/00: Package configurations - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film that covers the first component along a shape of the first component, and also covers a part of the first surface; a conductor film that covers at least a part of the resin film along the shape of the first component, and covers at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film. The conductor structure includes a first end portion, a second end portion, and an intermediate portion. The first end portion and the second end portion are connected to the first surface. The intermediate portion is in contact with the conductor film. ## Claims ### Claim 1 A module comprising: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component, and also covering a part of the first surface; a first conductor film covering at least a part of the resin film along the shape of the first component, and also covering at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film at a location where the first conductor film covers the first surface with the resin film being interposed therebetween, wherein the conductor structure includes a first end portion, a second end portion, and an intermediate portion connecting the first end portion and the second end portion, the first end portion is connected to the first surface, the second end portion is also connected to the first surface, and the intermediate portion is in contact with the first conductor film. ### Claim 2 (depends on 1) The module according to claim 1, wherein the intermediate portion is disposed to extend over the first conductor film. ### Claim 3 (depends on 2) The module according to claim 2, wherein the first conductor film includes a plurality of linear portions disposed to be parallel to each other with being spaced from each other, and the conductor structure is disposed to extend over at least one of the linear portions in a width direction. ### Claim 4 (depends on 3) The module according to claim 3, wherein the conductor structure is a wire. ### Claim 5 (depends on 3) The module according to claim 3, wherein the conductor structure is a metal pin. ### Claim 6 (depends on 3) The module according to claim 3, wherein the module further comprises a first sealing resin disposed to cover the first surface, the first conductor film, and the resin film, and a shield film disposed to cover an upper surface and side surfaces of the first sealing resin. ### Claim 7 (depends on 2) The module according to claim 2, wherein the conductor structure is a wire. ### Claim 8 (depends on 2) The module according to claim 2, wherein the conductor structure is a metal pin. ### Claim 9 (depends on 2) The module according to claim 2, wherein the module further comprises a first sealing resin disposed to cover the first surface, the first conductor film, and the resin film, and a shield film disposed to cover an upper surface and side surfaces of the first sealing resin. ### Claim 10 (depends on 1) The module according to claim 1, wherein the first conductor film covers the intermediate portion. ### Claim 11 (depends on 10) The module according to claim 10, wherein the conductor structure is a wire. ### Claim 12 (depends on 10) The module according to claim 10, wherein the conductor structure is a metal pin. ### Claim 13 (depends on 1) The module according to claim 1, wherein the conductor structure is a wire. ### Claim 14 (depends on 1) The module according to claim 1, wherein the conductor structure is a metal pin. ### Claim 15 (depends on 1) The module according to claim 1, wherein the module further comprises a first sealing resin disposed to cover the first surface, the first conductor film, and the resin film, and a shield film disposed to cover an upper surface and side surfaces of the first sealing resin. ### Claim 16 (depends on 1) The module according to claim 1, wherein the substrate has a second surface as a surface opposite to the first surface, and the module further comprises a second component mounted on the second surface. ### Claim 17 (depends on 16) The module according to claim 16, wherein the module further comprises a second sealing resin disposed to cover the second surface and the second component. ### Claim 18 (depends on 1) The module according to claim 1, further comprising an antenna. ### Claim 19 (depends on 18) The module according to claim 18, wherein the substrate has a second surface as a surface opposite to the first surface, and the antenna is disposed inside the substrate along the second surface. ### Claim 20 (depends on 18) The module according to claim 18, further comprising: a third component mounted on the first surface; and a second conductor film, wherein the resin film covers the third component along a shape of the third component, and also covers a part of the first surface, the second conductor film covers at least a part of the resin film along the shape of the third component, and covers at least a part of a portion in which the resin film covers the part of the first surface, and the first conductor film and the second conductor film are spaced from each other.