# US 12,193,160 B2 · Printed circuit board

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- Number: US 12,193,160 B2
- Document ID: US12193160B2
- Status: Granted
- Kind: B2
- Application number: 17/196,645
- Filed: 2021-03-09
- Published: 2022-05-19
- Granted: 2025-01-07
- Earliest claimed: 2020-11-19
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Jung Hyun Cho; Jin Won Lee; Byung Kuk Kang; Chang Soo Woo
- Web page: https://patentgrep.com/patent/US12193160B2

## CPC

- H05K 1/165: {incorporating printed inductors}
- H01F 17/0013: {with stacked layers}
- H01F 17/04: with magnetic core
- H01F 27/24: Magnetic cores
- H01F 27/2804: {Printed windings}
- H01F 27/306: {Fastening or mounting coils or windings on core, casing or other support}
- H05K 1/0298: {Multilayer circuits}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated}
- H01F 2017/002: {Details of via holes for interconnecting the layers}
- H05K 2201/086: for inductive purposes, e.g. printed inductor with ferrite core
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.

## Claims

### Claim 1

A printed circuit board comprising:
a core substrate including a plurality of core layers with a cavity disposed therein and first and second core insulating layers respectively extending on and below the plurality of core layers to cover the cavity;
a plurality of magnetic members embedded in the cavity;
a first coil pattern disposed on the first core insulating layer of the core substrate; and
a second coil pattern disposed below the second core insulating layer the core substrate.

### Claim 2 (depends on 1)

The printed circuit board of claim 1, further comprising:
build-up layers disposed on the first core insulating layer and below the second core insulating layer of the core substrate, respectively.

### Claim 3 (depends on 2)

The printed circuit board of claim 2, wherein the plurality of magnetic members are disposed in the cavity.

### Claim 4 (depends on 3)

The printed circuit board of claim 3, wherein a plurality of cavities are disposed in each of the plurality of core layers,
the plurality of magnetic members include at least one of first and second magnetic members,
the first magnetic member includes a magnetic element, and
the second magnetic member includes a base layer and a magnetic layer disposed on the base layer.

### Claim 5 (depends on 4)

The printed circuit board of claim 4, further comprising a through via penetrating through the core substrate,
wherein the build-up layers include a plurality of insulating layers and a plurality of wiring layers disposed on the plurality of insulating layers.

### Claim 6 (depends on 5)

The printed circuit board of claim 5, wherein the core substrate further includes a third core insulating layer disposed between the plurality of core layers, and
at least some of the plurality of magnetic members are disposed on one surface and the other surface of the third core insulating layer.

### Claim 7 (depends on 5)

The printed circuit board of claim 5, wherein
at least some of the plurality of magnetic members are in contact with the first core insulating layer and the second core insulating layer.

### Claim 8 (depends on 5)

The printed circuit board of claim 5, wherein the first and second coil patterns include first and second connection pads, respectively, each of the first and second connection pads being disposed at one or both ends of the respective coil patterns.

### Claim 9 (depends on 5)

The printed circuit board of claim 5, further comprising a connection via connecting respective innermost ends of the first and second coil patterns to each other.

### Claim 10 (depends on 9)

The printed circuit board of claim 9, wherein the connection via penetrates through the magnetic members.

### Claim 11 (depends on 5)

The printed circuit board of claim 5, wherein each of the first and second coil patterns has a plurality of layers stacked in a thickness direction.

### Claim 12 (depends on 5)

The printed circuit board of claim 5, further comprising an electronic component disposed on one of the build-up layers disposed on the one surface and the other surface of the core substrate,
wherein the magnetic layer is disposed on one of one surface and the other surface of the base layer that is closer to the electronic component.

### Claim 13 (depends on 4)

The printed circuit board of claim 4, wherein the base layer includes a wafer containing silicon (Si), and
the magnetic layer contains a cobalt-tantalum-zirconium alloy.

### Claim 14 (depends on 1)

The printed circuit board of claim 1, wherein the first and second coil patterns include a plurality of first and second connection parts spaced apart from each other, respectively, and a plurality of connection vias connecting the plurality of first and second connection parts to each other; and
the plurality of connection vias are disposed to surround the plurality of magnetic members on at least one side thereof.

### Claim 15 (depends on 14)

The printed circuit board of claim 14, further comprising:
a first connection pad connected to an end of each of at least some of the plurality of first connection parts;
a second connection pad disposed adjacent to a side surface of each of at least one of the plurality of second connection parts; and
a pad connection via penetrating through the core substrate to connect the first and second connection pads to each other.

### Claim 16 (depends on 1)

The printed circuit board of claim 1, wherein the plurality of magnetic members are spaced apart from at least one of the first coil pattern and the second coil pattern.

### Claim 17

A printed circuit board comprising:
a core substrate having a cavity;
a plurality of magnetic members embedded in the cavity;
a first coil pattern disposed on the core substrate and extending from a region of an upper side of the core substrate outside the cavity overlapping the cavity; and
a second coil pattern disposed below the core substrate and extending from a region of a lower side of the core substrate outside the cavity to a region of the lower side of the core substrate overlapping the cavity,
wherein the plurality of magnetic members include first and second magnetic members having structures different from each other,
the first magnetic member includes a magnetic element, and
the second magnetic member includes a base layer and a magnetic layer attached to the base layer.

### Claim 18 (depends on 17)

The printed circuit board of claim 17, further comprising a connection via connecting respective innermost ends of the first and second coil patterns to each other.

### Claim 19 (depends on 18)

The printed circuit board of claim 18, wherein the connection via penetrates through one of more magnetic members among the plurality magnetic members.

### Claim 20 (depends on 17)

The printed circuit board of claim 17, wherein the plurality of magnetic members are spaced apart from at least one of the first coil pattern and the second coil pattern.

### Claim 21

A printed circuit board comprising:
a core substrate including a core insulating layer, and first and second core layers disposed on opposing sides of the core insulating layer, respectively;
a first coil pattern disposed on the first core layer;
a second coil pattern disposed below the second core layer;
a first magnetic member disposed in a first cavity of the first core layer and between the first coil pattern and the core insulating layer; and
a second magnetic member disposed in a second cavity of the second core layer and between the second coil pattern and the core insulating layer,
wherein the first coil pattern is disposed on the core substrate and extends from a region of an upper side of the core substrate outside the first cavity to a region of the upper side of the core substrate overlapping the first cavity; and
the second coil pattern is disposed below the core substrate and extends from a region of a lower side of the core substrate outside the second cavity to a region of the lower side of the core substrate overlapping the second cavity.

### Claim 22 (depends on 21)

The printed circuit board of claim 21, further comprising build-up layers disposed on the first coil pattern or the second coil pattern.

### Claim 23 (depends on 21)

The printed circuit board of claim 21, wherein the first and second magnetic members are spaced apart from at least one of the first coil pattern and the second coil pattern.