# US 12,193,148 B2 · Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,148 B2 - Document ID: US12193148B2 - Status: Granted - Kind: B2 - Application number: 17/461,553 - Filed: 2021-08-30 - Published: 2021-12-16 - Granted: 2025-01-07 - Earliest claimed: 2019-03-15 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yoshihito Otsubo; Tadashi Nomura - Web page: https://patentgrep.com/patent/US12193148B2 ## CPC - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H05K 1/181: associated with surface mounted components - H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 90/00: Package configurations - H10W 99/00: Subject matter not provided for in other groups of this subclass - H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets} - H05K 2201/0715: provided by an outer layer of PCB - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A module is provided that includes a wiring substrate having a major surface, a plurality of components mounted on the major surface, and a conductor incorporated resin body mounted on the major surface. Moreover, the conductor incorporated resin body is disposed between the plurality of components and includes a conductor pattern therein that is grounded. ## Claims ### Claim 1 A module comprising: a wiring substrate having a first surface; a plurality of components mounted on the first surface; and a conductor incorporated resin body mounted on the first surface and that is disposed between the plurality of components, wherein the conductor incorporated resin body comprises a plurality of resin layers and a conductor pattern that is grounded and that includes a plurality of linear patterns disposed between the plurality of resin layers, such that the respective linear patterns are electrically insulated from each other by the respective resin layers that continuously extend between the respective linear patterns without any electrical interconnects extending between the respective linear patterns. ### Claim 2 (depends on 1) The module according to claim 1, wherein the conductor incorporated resin body includes a wall-shaped portion having the conductor pattern disposed therein. ### Claim 3 (depends on 1) The module according to claim 1, wherein the conductor incorporated resin body is disposed so as to straddle at least one component of the plurality of components. ### Claim 4 (depends on 1) The module according to claim 1, wherein the conductor incorporated resin body is disposed so as to include a portion overlapping an upper side of at least one component of the plurality of components. ### Claim 5 (depends on 1) The module according to claim 1, wherein the conductor incorporated resin body is a multilayer resin body. ### Claim 6 (depends on 1) The module according to claim 1, wherein one or more components of the plurality of components are also mounted on a second surface of the wiring substrate opposite to the first surface. ### Claim 7 (depends on 1) The module according to claim 1, wherein the conductor incorporated resin body comprises an L-shaped conductor in a plan view of the first surface of the wiring substrate. ### Claim 8 (depends on 2) The module according to claim 2, further comprising a sealing resin that seals at least one component of the plurality of components on the first surface of the wiring substrate. ### Claim 9 (depends on 5) The module according to claim 5, wherein the multilayer resin body comprises the plurality of resin layers with the conductor pattern being disposed between opposing surfaces of the plurality of resin layers. ### Claim 10 (depends on 7) The module according to claim 7, wherein an entire periphery of one or more components of the plurality of components is surrounded by the conductor in the plan view of the first surface of the wiring substrate. ### Claim 11 (depends on 8) The module according to claim 8, wherein the wall-shaped portion is disposed to isolate a portion of the sealing resin from another portion thereof. ### Claim 12 (depends on 8) The module according to claim 8, further comprising a shield film that covers an upper surface of the sealing resin and a side surface of the sealing resin. ### Claim 13 (depends on 9) The module according to claim 9, wherein the multilayer resin body comprises the conductor pattern being divided into a plurality of individual pieces that includes the plurality of linear patterns, respectively. ### Claim 14 (depends on 9) The module according to claim 9, wherein the conductor incorporated resin body is disposed on the first surface between at least two of the plurality of components relative to a plan view of the first surface of the wiring substrate. ### Claim 15 (depends on 12) The module according to claim 12, wherein the shield film is electrically connected to the conductor pattern. ### Claim 16 A module comprising: a wiring substrate having first surface; a plurality of components mounted on the first surface; a resin body mounted on the first surface and that is disposed between at least two components of the plurality of components; a sealing resin that seals at least one of the two components; and a shield film that covers at least an upper surface of the sealing resin, wherein the resin body comprises a plurality of resin layers and a conductor pattern hat is grounded by being electrically connected to the shield film, and wherein the conductor pattern includes a plurality of linear patterns disposed between the plurality of resin layers, respectively, such that the respective linear patterns are electrically insulated from each other by the respective resin layers that continuously extend between the respective linear patterns without any electrical interconnects extending between the respective linear patterns. ### Claim 17 (depends on 16) The module according to claim 16, wherein the shield film is electrically connected to a ground electrode provided to wiring substrate.