# US 12,193,147 B2 · Electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,147 B2 - Document ID: US12193147B2 - Status: Granted - Kind: B2 - Application number: 18/067,826 - Filed: 2022-12-19 - Published: 2023-04-20 - Granted: 2025-01-07 - Earliest claimed: 2020-06-22 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Ikuo Deguchi - Web page: https://patentgrep.com/patent/US12193147B2 ## CPC - H01G 2/06: specially adapted for mounting on a printed-circuit support - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H01G 2/10: Housing; Encapsulation - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H03H 7/01: Frequency selective two-port networks - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 99/00: Subject matter not provided for in other groups of this subclass - H01F 27/363: {made of electrically conductive material} - H01G 2/22: Electrostatic or magnetic shielding - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 2201/0715: provided by an outer layer of PCB - H05K 2201/0919: Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes - H05K 2201/10015: Non-printed capacitor - H05K 2201/1003: Non-printed inductor - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract An electronic component includes: an insulating substrate including a first main surface and a second main surface opposite to each other in a thickness direction and a side surface with a plurality of ground electrodes exposed thereto; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films. The plurality of ground electrodes includes a first ground electrode and a second ground electrode, the first ground electrode and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface and at a position closest to the second main surface, respectively. ## Claims ### Claim 1 An electronic component comprising: an insulating substrate including a first main surface, a second main surface, a side surface and a plurality of ground electrodes, the first main surface and the second main surface being opposite to each other in a thickness direction, and the plurality of ground electrodes being exposed to the side surface; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films, the plurality of ground electrodes including a first ground electrode and a second ground electrode, the first ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface of the insulating substrate and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the second main surface of the insulating substrate, the conductive films including a first conductive film covering a surface of the first ground electrode and a second conductive film covering a surface of the second ground electrode, a thickness of the second conductive film being greater than a thickness of the first conductive film. ### Claim 2 (depends on 1) The electronic component according to claim 1, wherein the shielding film is not electrically connected to an electrode provided at the second main surface of the insulating substrate. ### Claim 3 (depends on 2) The electronic component according to claim 2, wherein an electrical resistivity of the second ground electrode is lower than an electrical resistivity of the first ground electrode. ### Claim 4 (depends on 2) The electronic component according to claim 2, wherein a contact area between the second ground electrode and the second conductive film is larger than a contact area between the first ground electrode and the first conductive film. ### Claim 5 (depends on 3) The electronic component according to claim 3, wherein a contact area between the second ground electrode and the second conductive film is larger than a contact area between the first ground electrode and the first conductive film. ### Claim 6 (depends on 2) The electronic component according to claim 2, wherein a total area of the second ground electrode exposed to a surface of the insulating substrate is smaller than a total area of the first ground electrode exposed to the surface of the insulating substrate. ### Claim 7 (depends on 2) The electronic component according to claim 2, wherein the first conductive film and the second conductive film are apart from each other. ### Claim 8 (depends on 2) The electronic component according to claim 2, wherein the first conductive film and the second conductive film have different compositions. ### Claim 9 (depends on 1) The electronic component according to claim 1, wherein an electrical resistivity of the second ground electrode is lower than an electrical resistivity of the first ground electrode. ### Claim 10 (depends on 9) The electronic component according to claim 9, wherein a total area of the second ground electrode exposed to a surface of the insulating substrate is smaller than a total area of the first ground electrode exposed to the surface of the insulating substrate. ### Claim 11 (depends on 9) The electronic component according to claim 9, wherein the first conductive film and the second conductive film are apart from each other. ### Claim 12 (depends on 9) The electronic component according to claim 9, wherein the first conductive film and the second conductive film have different compositions. ### Claim 13 (depends on 1) The electronic component according to claim 1, wherein a contact area between the second ground electrode and the second conductive film is larger than a contact area between the first ground electrode and the first conductive film. ### Claim 14 (depends on 13) The electronic component according to claim 13, wherein a total area of the second ground electrode exposed to a surface of the insulating substrate is smaller than a total area of the first ground electrode exposed to the surface of the insulating substrate. ### Claim 15 (depends on 13) The electronic component according to claim 13, wherein the first conductive film and the second conductive film are apart from each other. ### Claim 16 (depends on 1) The electronic component according to claim 1, wherein a total area of the second ground electrode exposed to a surface of the insulating substrate is smaller than a total area of the first ground electrode exposed to the surface of the insulating substrate. ### Claim 17 (depends on 16) The electronic component according to claim 16, wherein the first conductive film and the second conductive film are apart from each other. ### Claim 18 (depends on 1) The electronic component according to claim 1, wherein the first conductive film and the second conductive film are apart from each other. ### Claim 19 (depends on 1) The electronic component according to claim 1, wherein the first conductive film and the second conductive film have different compositions. ### Claim 20 (depends on 1) The electronic component according to claim 1, wherein the first conductive film covers only the surface of the first ground electrode and a vicinity thereof and the second conductive film covers only the surface of the second ground electrode and a vicinity thereof.