# US 12,193,145 B2 · Substrate for mounting electronic element, electronic device, and electronic module preliminary class > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,145 B2 - Document ID: US12193145B2 - Status: Granted - Kind: B2 - Application number: 18/157,176 - Filed: 2023-01-20 - Published: 2023-05-18 - Granted: 2025-01-07 - Earliest claimed: 2018-03-28 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Yukio Morita; Noboru Kitazumi; Yousuke Moriyama - Web page: https://patentgrep.com/patent/US12193145B2 ## CPC - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements} - H01S 5/4025: {Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence)} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/181: associated with surface mounted components - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 3/4608: {comprising an electrically conductive base or core} - H10H 20/8581: {characterised by their material} - H10H 20/8582: {characterised by their shape} - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC} - H05K 1/0206: {by printed thermal vias} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 2201/0323: Carbon - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate. ## Claims ### Claim 1 A substrate comprising: a pair of first members containing carbon, having a structure in which graphenes, comprising six-membered rings that are covalently connected, are stacked, and having a quadrangular prism shape; a second member positioned between the pair of first members; a third member; a plating layer formed on the third member; a first surface intersecting a second direction; and a second surface opposite the first surface, wherein the pair of first members is positioned side by side in a first direction, the first direction intersecting the second direction, each first member in the pair of first members and the second member has different thermal conductivity characteristics, the thermal conductivity characteristic of the pair of first members is more anisotropic than the thermal conductivity characteristic of the second member, in the first direction, the thermal conductivity of the first member is lower than the thermal conductivity of the second member, in the second direction, thermal conductivity of the first member is greater than the thermal conductivity of the second member, in a cross-sectional view in the first direction, a thickness of the each first member is larger than a thickness of the second member, the third member covers a surface of a plate-shaped member unit formed by combining the pair of first members and the second member along a plane intersecting the second direction, the first surface includes a region where an electronic element is attached, and in the region, a position of the electronic element with respect to the each first member and the second member is fixed via the third member. ### Claim 2 (depends on 1) The substrate according to claim 1, wherein in a third direction intersecting the first direction and the second direction, the thermal conductivity of the each first member is greater than the thermal conductivity of the second member. ### Claim 3 (depends on 2) The substrate according to claim 2, wherein in the first direction, a width of the second member is less than a width of the each first member. ### Claim 4 (depends on 1) The substrate according to claim 1, wherein the pair of first members and the third member has different thermal conductivity characteristics, the thermal conductivity characteristic of the pair of first members is more anisotropic than the thermal conductivity characteristic of the third member, in the second direction, the thermal conductivity of the pair of first members is greater than the thermal conductivity of the third member, and in the first direction, thermal conductivity of the pair of first members is lower than the thermal conductivity of the third member. ### Claim 5 (depends on 1) The substrate according to claim 1, wherein a material of the third member is different from materials of the pair of first members and the second member. ### Claim 6 (depends on 5) The substrate according to claim 5, wherein in the second direction, a thickness of the third member is less than a thickness of the each first member. ### Claim 7 (depends on 6) The substrate according to claim 6, wherein in a third direction intersecting the first direction and the second direction, a dimension of the third member is greater than a dimension of the pair of first members. ### Claim 8 (depends on 1) The substrate according to claim 1, wherein of the first surface and the second surface, only the first surface includes the region. ### Claim 9 (depends on 1) The substrate according to claim 1, wherein in the second direction, the region overlaps with the pair of first members. ### Claim 10 (depends on 1) The substrate according to claim 1, wherein the third member includes the first surface. ### Claim 11 (depends on 1) The substrate according to claim 1, wherein the first surface and the second surface cover the pair of first members and the second member such that the pair of first members and the second member are not exposed.