# US 12,193,144 B2 · Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,144 B2 - Document ID: US12193144B2 - Status: Granted - Kind: B2 - Application number: 17/478,355 - Filed: 2021-09-17 - Published: 2022-01-06 - Granted: 2025-01-07 - Earliest claimed: 2019-03-28 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yukio Yamamoto; Yoshihito Otsubo - Web page: https://patentgrep.com/patent/US12193144B2 ## CPC - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 70/095: {of vias therein} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/635: {Through-vias} - H10W 74/114: {by a substrate and the encapsulations} - H05K 2201/0376: Flush conductors, i.e. flush with the surface of the printed circuit - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A modules is provided in which an electronic component is disposed on a first main surface and each of a plurality of first connection terminals is disposed on a second main surface. Moreover, a second connection terminal is disposed on the second main surface. When a substrate is viewed in a direction perpendicular to the second main surface, the second connection terminal is larger in area than each of the first connection terminals. When the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed on a straight line connecting the first connection terminals. The second connection terminal serves to establish an electrical connection. ## Claims ### Claim 1 A module comprising: a substrate having a first main surface and a second main surface that opposes the first main surface; an electronic component disposed on the first main surface; a first sealing resin disposed on the first main surface to seal the electronic component; a plurality of first connection terminals disposed on the second main surface; a second connection terminal disposed on the second main surface; and a second sealing resin disposed on the second main surface, such that an end portion of each of the first connection terminals and the second connection terminal is exposed, with each respective end portion being located opposite to the second main surface, wherein the second connection terminal has an area larger than an area of each of the first connection terminals when the substrate is viewed in a direction perpendicular to the second main surface, and wherein the second connection terminal is disposed on a straight line that connects the respective first connection terminals when the substrate is viewed in the direction perpendicular to the second main surface, wherein the second connection terminal establishes is configured to establish an electrical connection between the electronic component and a terminal of a motherboard when the module is mounted thereto, and wherein the second connection terminal does not overlap each of the plurality of first connection terminals on the second main surface in the direction perpendicular to the second main surface. ### Claim 2 (depends on 1) The module according to claim 1, wherein the second connection terminal is a ground terminal. ### Claim 3 (depends on 1) The module according to claim 1, wherein the electronic component is a heat generating component, and when the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed at a position to overlap the electronic component. ### Claim 4 (depends on 1) The module according to claim 1, wherein the second connection terminal surrounds one of the first connection terminals when the substrate is viewed in the direction perpendicular to the second main surface. ### Claim 5 (depends on 1) The module according to claim 1, further comprising at least one third connection terminal disposed on the second main surface. ### Claim 6 (depends on 5) The module according to claim 5, wherein the at least one third connection terminal has an area larger than the area of each of the first connection terminals when the substrate is viewed in the direction perpendicular to the second main surface. ### Claim 7 (depends on 6) The module according to claim 6, wherein the at least one third connection terminal is disposed closer to a corner of the substrate than each of the first connection terminals and the second connection terminal. ### Claim 8 (depends on 7) The module according to claim 7, wherein the second main surface of the substrate has a rectangular frame shape when the substrate is viewed in the direction perpendicular to the second main surface. ### Claim 9 (depends on 8) The module according to claim 8, wherein the at least one third connection terminal comprises four third connection terminals disposed on respective vertex points of four vertex points of the rectangular frame shape of the second main surface of the substrate. ### Claim 10 (depends on 1) The module according to claim 1, wherein the second connection terminal is connected to the electronic component through a plurality of pillar-shaped conductors extending through the substrate. ### Claim 11 (depends on 1) The module according to claim 1, wherein each of the first connection terminals and the second connection terminal are protruding electrodes that extend away from the second main surface of the substrate. ### Claim 12 (depends on 1) The module according to claim 1, further comprising a shield layer that entirely covers an upper surface of first sealing resin, peripheral side surfaces of first sealing resin, the substrate and the second sealing resin. ### Claim 13 (depends on 1) The module according to claim 1, wherein the second connection terminal has an L-shaped outline when the substrate is viewed in the direction perpendicular to second main surface of the substrate. ### Claim 14 (depends on 1) The module according to claim 1, further comprising at least one additional electronic component disposed on the first main surface of the substrate. ### Claim 15 (depends on 14) The module according to claim 14, wherein the substrate comprises a multilayer wiring line that is electrically connected to the at least one additional electronic component. ### Claim 16 A module comprising: a substrate having a first main surface and a second main surface that opposes the first main surface; an electronic component disposed on the first main surface; a plurality of first connection terminals disposed on the second main surface; a second connection terminal disposed on the second main surface and establishes an electrical connection between the electronic component and a terminal of a motherboard when the module is mounted thereto; and a sealing resin disposed on the second main surface that exposes each of the first connection terminals and the second connection terminal from the module and opposite to the second main surface of the substrate, wherein the second connection terminal has surface area opposite the second main surface that is larger than a surface area of each of the first connection terminals opposite the second main surface, and wherein the second connection terminal does not overlap each of the plurality of first connection terminals on the second main surface in a direction perpendicular to the second main surface. ### Claim 17 (depends on 16) The module according to claim 16, wherein the second connection terminal is disposed on a straight line that connects respective end portions of the first connection terminals. ### Claim 18 (depends on 16) The module according to claim 16, wherein the electronic component is a heat generating component, and when the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed at a position that overlaps the electronic component. ### Claim 19 (depends on 16) The module according to claim 16, wherein the second connection terminal surrounds one of the first connection terminals when the substrate is viewed in the direction perpendicular to the second main surface. ### Claim 20 (depends on 16) The module according to claim 16, further comprising: at least one third connection terminal disposed on the second main surface, wherein the at least one third connection terminal has a surface area opposite the second main surface that is larger than the surface area of each of the first connection terminals, and wherein the at least one third connection terminal is disposed closer to a corner of the substrate than each of the first connection terminals and the second connection terminal.