# US 12,193,143 B2 · Circuit board module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,193,143 B2 - Document ID: US12193143B2 - Status: Granted - Kind: B2 - Application number: 17/933,114 - Filed: 2022-09-18 - Published: 2023-01-12 - Granted: 2025-01-07 - Earliest claimed: 2020-03-18 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Tatsuya Hosotani - Web page: https://patentgrep.com/patent/US12193143B2 ## CPC - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - G06F 1/189: {Power distribution} - G06F 1/20: Cooling means - G06F 1/206: {comprising thermal management} - G06F 1/26: Power supply means, e.g. regulation thereof (for memories G11C) - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 40/25: characterised by their materials - H10W 40/251: {Organics} - H10W 90/00: Package configurations - H05K 1/0207: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes} - H05K 3/3415: {on both sides of the substrate or combined with lead-in-hole components} - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/1003: Non-printed inductor - H05K 2201/10378: Interposers - H05K 2201/10545: Related components mounted on both sides of the PCB - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A first circuit board includes a positive output pin and a negative output pin of a power conversion circuit, each of which has a shape projecting from a second main surface. A second circuit board has a positive through via and a negative through via, each of which has a shape extending between a third main surface and a fourth main surface. The second main surface of the first circuit board and the third main surface of the second circuit board are physically in close contact with each other. The positive output pin is inserted through the positive through via to reach the fourth main surface. The negative output pin is inserted through the negative through via in such a manner as to reach the fourth main surface. The load receives a current supplied from the power conversion circuit through the positive output pin and the negative output pin. ## Claims ### Claim 1 A circuit board module comprising: a first circuit board that has a first main surface on which a power semiconductor device is mounted and a second main surface and that configures a power conversion circuit; and a second circuit board having a third main surface and a fourth main surface on which is mounted a load that is configured to receive a current supplied by the power conversion circuit and is electrically connected to the fourth main surface, wherein the first circuit board includes a positive output pin of the power conversion circuit and a negative output pin of the power conversion circuit, each of which has a shape projecting from the second main surface, the second circuit board has a positive through via and a negative through via, each of which has a shape extending between the third main surface and the fourth main surface, the second main surface of the first circuit board and the third main surface of the second circuit board are physically in proximate contact with each other, the positive output pin is inserted through the positive through via in such a manner as to reach the fourth main surface, the negative output pin is inserted through the negative through via in such a manner as to reach the fourth main surface, and the load is configured to receive the current supplied from the power conversion circuit through the positive output pin and the negative output pin. ### Claim 2 (depends on 1) The circuit board module according to claim 1, further comprising: a first thermally-conductive sheet that is between the first circuit board and the second circuit board, wherein the second main surface of the first circuit board and the third main surface of the second circuit board are in proximate contact with each other physically and thermally with the first thermally-conductive sheet interposed between the second main surface and the third main surface. ### Claim 3 (depends on 1) The circuit board module according to claim 1, wherein the first thermally-conductive sheet has an electrical insulating property, and the second main surface of the first circuit board and the third main surface of the second circuit board are electrically insulated from each other. ### Claim 4 (depends on 2) The circuit board module according to claim 2, wherein the first thermally-conductive sheet has electrical conductivity, and the first thermally-conductive sheet is electrically connected to the negative through via and the negative output pin and electrically insulated from the positive through via and the positive output pin. ### Claim 5 (depends on 2) The circuit board module according to claim 2, wherein the first thermally-conductive sheet has flexibility. ### Claim 6 (depends on 2) The circuit board module according to claim 2, wherein the first thermally-conductive sheet has an area larger than an area of the first circuit board. ### Claim 7 (depends on 4) The circuit board module according to claim 4, wherein the first thermally-conductive sheet contains graphite that has a thermal conductivity higher than a thermal conductivity of a metal. ### Claim 8 (depends on 3) The circuit board module according to claim 3, wherein the first thermally-conductive sheet contains a silicone. ### Claim 9 (depends on 1) The circuit board module according to claim 1, wherein the first circuit board and the load overlap each other when viewed in plan view. ### Claim 10 (depends on 1) The circuit board module according to claim 1, further comprising: a second thermally-conductive sheet that is on the first main surface and that is in contact with the power semiconductor device in such a manner as to cover the power semiconductor device; and a heat sink that is in contact with the second thermally-conductive sheet in a planar manner. ### Claim 11 (depends on 10) The circuit board module according to claim 10, further comprising: a radiator that is on the fourth main surface of the second circuit board and that dissipates heat generated by the load. ### Claim 12 (depends on 1) The circuit board module according to claim 1, wherein the load includes at least one of a CPU, a GPU, and an MPU. ### Claim 13 (depends on 2) The circuit board module according to claim 2, wherein the first thermally-conductive sheet has an electrical insulating property, and the second main surface of the first circuit board and the third main surface of the second circuit board are electrically insulated from each other. ### Claim 14 (depends on 3) The circuit board module according to claim 3, wherein the first thermally-conductive sheet has flexibility. ### Claim 15 (depends on 4) The circuit board module according to claim 4, wherein the first thermally-conductive sheet has flexibility. ### Claim 16 (depends on 3) The circuit board module according to claim 3, wherein the first thermally-conductive sheet has an area larger than an area of the first circuit board. ### Claim 17 (depends on 4) The circuit board module according to claim 4, wherein the first thermally-conductive sheet has an area larger than an area of the first circuit board. ### Claim 18 (depends on 2) The circuit board module according to claim 2, wherein the first circuit board and the load overlap each other when viewed in plan view. ### Claim 19 (depends on 2) The circuit board module according to claim 2, further comprising: a second thermally-conductive sheet that is on the first main surface and that is in contact with the power semiconductor device in such a manner as to cover the power semiconductor device; and a heat sink that is in contact with the second thermally-conductive sheet in a planar manner. ### Claim 20 (depends on 2) The circuit board module according to claim 2, wherein the load includes at least one of a CPU, a GPU, and an MPU.