# US 12,192,704 B2 · Microelectromechanical system microphone array capsule > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,192,704 B2 - Document ID: US12192704B2 - Status: Granted - Kind: B2 - Application number: 18/063,374 - Filed: 2022-12-08 - Published: 2023-06-15 - Granted: 2025-01-07 - Earliest claimed: 2021-12-14 - Assignees: InvenSense, Inc. - Applicants: Invensense, Inc. - Inventors: Jeremy Parker - Web page: https://patentgrep.com/patent/US12192704B2 ## CPC - H04R 19/005: {using semiconductor materials} - H04R 19/04: Microphones (H04R19/01 takes precedence) - H04R 1/245: {of microphones} - H04R 1/04: Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) - H04R 1/2869: {Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself} - H04R 1/38: in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone - H04R 2201/003: Mems transducers or their use - H04R 2410/03: Reduction of intrinsic noise in microphones - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) ## Abstract The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit. ## Claims ### Claim 1 A microelectromechanical system (MEMS) microphone comprising: a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit. ### Claim 2 (depends on 1) The MEMS microphone of claim 1, wherein the different resonant frequencies of the respective ones of the plurality of MEMS acoustic sensor elements range from an upper resonant frequency to a lower resonant frequency, and wherein a difference between the upper resonant frequency and the lower resonant frequency is greater than a frequency tolerance associated with the plurality of MEMS acoustic sensor elements. ### Claim 3 (depends on 1) The MEMS microphone of claim 1, wherein the impedance converter circuit comprises a junction-gate field-effect transistor (JFET). ### Claim 4 (depends on 3) The MEMS microphone of claim 3, wherein an output capacitance of the acoustic sensor array is greater than an input capacitance of the JFET. ### Claim 5 (depends on 1) The MEMS microphone of claim 1, wherein each of the plurality of MEMS acoustic sensor elements are damped according to a damping ratio selected from the group consisting of an overdamped damping ratio and a critically damped damping ratio. ### Claim 6 (depends on 1) The MEMS microphone of claim 1, further comprising: a laminate board having an opening, wherein the MEMS microphone die is positioned within the opening, and wherein the interconnect comprises a wirebond formed onto the laminate board. ### Claim 7 A microelectromechanical system (MEMS) microphone comprising: a housing assembly; a first opening, of a first size, formed into a surface of the housing assembly; a sensor layer, situated parallel to the surface of the housing assembly and hermetically sealed to an interior of the housing assembly, the sensor layer comprising a MEMS acoustic sensor array having a second size that is no greater than the first size; a connector layer removably coupled to the sensor layer at a defined distance from the sensor layer, resulting in a gap between the sensor layer and the connector layer, wherein the connector layer is situated parallel to the sensor layer and hermetically sealed to the interior of the housing assembly; and a second opening formed into the housing assembly that exposes the gap between the sensor layer and the connector layer to an environment. ### Claim 8 (depends on 7) The MEMS microphone of claim 7, wherein the surface is a first surface, and wherein the MEMS microphone further comprises: an output connector coupled to a second surface of the connector layer that is opposite the sensor layer, wherein the output connector facilitates conveyance of an audio signal produced by the MEMS acoustic sensor array. ### Claim 9 (depends on 8) The MEMS microphone of claim 8, wherein the output connector is an insulation-displacement connector. ### Claim 10 (depends on 7) The MEMS microphone of claim 7, further comprising: a layer of screen material positioned between the surface of the housing assembly and the sensor layer. ### Claim 11 (depends on 10) The MEMS microphone of claim 10, wherein the layer of screen material is adjacent to the surface of the housing assembly and the sensor layer. ### Claim 12 (depends on 7) The MEMS microphone of claim 7, further comprising: spacer pins that removably couple the sensor layer to the connector layer, the spacer pins having a length that is equal to the defined distance. ### Claim 13 A microelectromechanical system (MEMS) microphone comprising: a circuit board having an opening of a first size located at a position relative to the circuit board; a MEMS microphone array, of the first size, situated within the opening of the circuit board; a housing that encapsulates the circuit board and the MEMS microphone array, wherein the housing comprises a port aperture, of a second size that is no smaller than the first size and formed into the housing at the position relative to the circuit board, resulting in a first surface of the MEMS microphone array being exposed to an environment; and a backing platform removably coupled to a second surface of the circuit board that is opposite the first surface of the MEMS microphone array, wherein the housing further encapsulates the backing platform. ### Claim 14 (depends on 13) The MEMS microphone of claim 13, wherein the MEMS microphone array comprises a plurality of MEMS acoustic sensor elements, and wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies. ### Claim 15 (depends on 13) The MEMS microphone of claim 13, wherein a third surface of the backing platform is removably connected to the second surface of the circuit board, and wherein the MEMS microphone further comprises: an output connector coupled to a fourth surface of the backing platform that is opposite the third surface, wherein the output connector facilitates conveyance of an audio signal produced by the MEMS microphone array. ### Claim 16 (depends on 13) The MEMS microphone of claim 13, wherein the circuit board is a first circuit board, and wherein the backing platform is a second circuit board. ### Claim 17 (depends on 13) The MEMS microphone of claim 13, wherein a first perimeter of the circuit board and a second perimeter of the backing platform are hermetically sealed to an interior of the housing, resulting in a back volume bounded by the circuit board, the backing platform, and the housing. ### Claim 18 (depends on 17) The MEMS microphone of claim 17, wherein the housing further comprises at least one perimeter aperture formed into the housing between the circuit board and the backing platform, resulting in the back volume being exposed to the environment. ### Claim 19 (depends on 13) The MEMS microphone of claim 13, further comprising: an impedance converter circuit situated on the circuit board; and an interconnect that electrically couples the MEMS microphone array to the impedance converter circuit. ### Claim 20 (depends on 19) The MEMS microphone of claim 19, wherein the impedance converter circuit comprises a junction-gate field-effect transistor (JFET).