# US 12,191,585 B2 · Antenna package and image display device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,585 B2 - Document ID: US12191585B2 - Status: Granted - Kind: B2 - Application number: 17/981,580 - Filed: 2022-11-07 - Published: 2023-02-23 - Granted: 2025-01-07 - Earliest claimed: 2020-05-07 - Assignees: Dongwoo Fine-Chem Co., Ltd.; Postech Research and Business Development Foundation - Applicants: Dongwoo Fine-Chem Co., Ltd.; Postech Research and Business Development Foundation - Inventors: Byung Jin Choi; Ho Dong Yoon; Won Hee Lee; Won Bin Hong - Web page: https://patentgrep.com/patent/US12191585B2 ## CPC - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)} - H01Q 1/243: {with built-in antennas} - H01Q 1/364: {using a particular conducting material, e.g. superconductor} - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 21/08: the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)} - H05K 1/02: Details - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An antenna package according to an embodiment includes an antenna unit, and a circuit board electrically connected to the antenna unit. The circuit board may include a core layer, a signal transmission wiring disposed on one surface of the core layer, the signal transmission wiring having one end portion connected to the antenna unit, a ground layer disposed on an opposite surface facing the one surface of the core layer, and a first via structure formed through the core layer and arranged around the one end portion of the signal transmission wiring to be in contact with the ground layer. ## Claims ### Claim 1 An antenna package, comprising: an antenna unit; and a circuit board electrically connected to the antenna unit, the circuit board comprising: a core layer; a signal transmission wiring disposed on one surface of the core layer, the signal transmission wiring having one end portion connected to the antenna unit; a ground layer disposed on an opposite surface facing the one surface of the core layer; a first via structure formed through the core layer and arranged around the one end portion of the signal transmission wiring to be in contact with the ground layer; and a ground pattern disposed around an opposite end portion of the signal transmission wiring on the one surface of the core layer. ### Claim 2 (depends on 1) The antenna package of claim 1, wherein the circuit board further comprises a bonding pattern disposed around the one end portion of the signal transmission wiring on the one surface of the core layer. ### Claim 3 (depends on 2) The antenna package of claim 2, wherein the first via structure contacts the bonding pattern and the ground layer. ### Claim 4 (depends on 2) The antenna package of claim 2, wherein the antenna unit comprises a plurality of antenna units arranged in a width direction, and the signal transmission wiring comprises a plurality of signal transmission wirings, each of which is connected to each of the antenna units. ### Claim 5 (depends on 4) The antenna package of claim 4, wherein the bonding pattern comprises a plurality of bonding patterns arranged along the width direction to be spaced apart from the signal transmission wirings; and the first via structure comprises a plurality of first via structures in contact with the bonding patterns, and the plurality of first via structures are arranged along the width direction to form a first via row. ### Claim 6 (depends on 2) The antenna package of claim 2, wherein the antenna unit comprises a radiator, a transmission line extending from the radiator, a signal pad formed at a terminal end of the transmission line, and an antenna ground pad disposed around the signal pad; and the signal transmission wiring is electrically connected to the signal pad, and the bonding pattern is electrically connected to the antenna ground pad. ### Claim 7 (depends on 1) The antenna package of claim 1, wherein the circuit board further comprises second via structures arranged around the signal transmission wiring, and the second via structures are formed through the core layer to be in contact with the ground layer. ### Claim 8 (depends on 7) The antenna package of claim 7, wherein the second via structures are arranged along an extension direction of the signal transmission wiring to form second via columns, and wherein the signal transmission wiring comprises a plurality of signal transmission wirings and the second via columns are disposed between the plurality of signal transmission wirings. ### Claim 9 (depends on 1) The antenna package of claim 1, wherein the circuit board further comprises a third via structure formed through the core layer to be in contact with the ground pattern and the ground layer. ### Claim 10 (depends on 9) The antenna package of claim 9, wherein the third via structure comprises a plurality of third via structures arranged along an extension direction of the signal transmission wiring or the ground pattern to form a third via column. ### Claim 11 (depends on 10) The antenna package of claim 10, wherein the third via column comprises a plurality of third via columns, and the signal transmission wiring comprises a plurality of signal transmission wirings; and the plurality of third via columns are disposed between the plurality of signal transmission wirings. ### Claim 12 (depends on 1) The antenna package of claim 1, further comprising an antenna driving integrated circuit chip electrically connected to an opposite end portion of the signal transmission wiring. ### Claim 13 (depends on 12) The antenna package of claim 12, further comprising an intermediate circuit board disposed between the opposite end portion of the signal transmission wiring and the antenna driving integrated circuit chip. ### Claim 14 (depends on 13) The antenna package of claim 13, wherein the circuit board includes a flexible printed circuit board, and the intermediate circuit board includes a rigid printed circuit board. ### Claim 15 (depends on 1) An image display device comprising the antenna package of claim 1.