Antenna with graded dielectirc and method of making the same
AssigneeIntel Corporation
InventorsSaravana Maruthamuthu, Bernd Waidhas, Andreas Augustin, Georg Seidemann
Life of this patent
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Abstract
Some embodiments include packages and methods of making the packages. One of the packages includes a ground layer (e.g., a ground plane) of metal formed over a chip of die, an antenna element of metal formed over the ground layer, and a dielectric lens formed over the antenna element. The dielectric lens includes a plurality of dielectric layers that have graded dielectric constants in a decreasing order along a direction from the antenna element toward a top surface of the package.
Claims22
A package, comprising:
- a die;
- an antenna over the die;
- and
- a plurality of dielectric layers stacked over the antenna, wherein horizontal dimensions of the plurality of dielectric layers increase along a direction from the antenna towards a top surface of the package.
A package, comprising:
- a die;
- an antenna over the die;
- a plurality of dielectric layers stacked over the antenna;
- and
- a printed circuit board over a top surface of the plurality of dielectric layers, wherein the printed circuit board includes an opening exposing a portion of the top surface of the plurality of dielectric layers to air.
A method of making a package, the method comprising:
- forming an antenna over a die;
- and
- forming a plurality of dielectric layers over the antenna, wherein horizontal dimensions of the plurality of dielectric layers increase along a direction from the antenna towards a top surface of the package.
Dependencies are inferred from the claim text.