# US 12,191,436 B2 · Emitter and method for emitting light > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,436 B2 - Document ID: US12191436B2 - Status: Granted - Kind: B2 - Application number: 17/629,195 - Filed: 2020-07-28 - Published: 2022-08-04 - Granted: 2025-01-07 - Earliest claimed: 2019-08-30 - Assignees: Würth Elektronik eiSos GmbH & Co. KG - Applicants: WüRth Elektronik Eisos GmbH & Co. KG - Inventors: Zhelio Andreev; Marcel Dörr - Web page: https://patentgrep.com/patent/US12191436B2 ## CPC - F21V 29/503: of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) - H10H 20/8582: {characterised by their shape} - F21V 29/59: {with forced flow of the coolant} - F21V 29/83: the elements having apertures, ducts or channels, e.g. heat radiation holes - H05K 1/0272: {Adaptations for fluid transport, e.g. channels, holes} - H10H 20/853: characterised by their shape - H10H 20/855: Optical field-shaping means, e.g. lenses - H10W 90/00: Package configurations - F21Y 2115/10: Light-emitting diodes [LED] - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 2201/064: Fluid cooling, e.g. by integral pipes - H05K 2201/10106: Light emitting diode [LED] - H10H 20/0363: {of optical field-shaping means} - H10H 20/0365: {of means for heat extraction or cooling} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/856: Reflecting means - H10H 20/8586: {comprising fluids, e.g. heat-pipes} - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract An emitter and a method for emitting light are described. The emitter has a substrate with a substrate surface and at least one LED element arranged on the substrate surface for generating the light to be emitted. An active cooling unit for cooling the at least one LED element has at least one cooling channel. The at least one cooling channel is arranged on the substrate surface in a beam path of at least one portion of the light to be emitted, which can be generated by means of the at least one LED element, for redirecting the light to be emitted. ## Claims ### Claim 1 An emitter for emitting light, comprising a substrate having a substrate surface, at least one LED element arranged on the substrate surface for generating the light to be emitted, and an active cooling unit for cooling the at least one LED element with at least one cooling channel for a coolant, wherein the at least one cooling channel is arranged in a beam path of at least a part of the light to be emitted which can be generated by means of the at least one LED element, for redirecting the light to be emitted, wherein the redirection of the light to be emitted takes place without changing a frequency of the light to be emitted, wherein the at least one LED element and the at least one cooling channel are embedded in a transparent encapsulation, wherein a refractive index nE of the transparent encapsulation is greater than a refractive index nK of the cooling channel, and wherein a surface tangent of a region of a cooling channel boundary surface of the at least one cooling channel facing the at least one LED element runs at an angle d to the substrate surface, where the following applies: d≤90°−sin−1(nK/nE). ### Claim 2 (depends on 1) The emitter according to claim 1, wherein at least part of the light to be emitted can be redirected by the at least one cooling channel in the direction of a predefined main emission direction. ### Claim 3 (depends on 1) The emitter according to claim 1, wherein at least part of the light to be emitted can be redirected by the at least one cooling channel in a main emission direction defined to be perpendicular to the substrate surface. ### Claim 4 (depends on 1) The emitter according to claim 1, wherein a cooling channel boundary surface of the at least one cooling channel is formed, at least in regions, in such a way that at least one portion of the light to be emitted is reflected at the cooling channel boundary surface. ### Claim 5 (depends on 1) The emitter according to claim 1, wherein the at least one cooling channel is arranged adjacent to the at least one LED element, in a plane formed by the substrate surface. ### Claim 6 (depends on 5) The emitter according to claim 5, wherein the at least one LED element adjoins the at least one cooling channel on at least two sides in the plane defined by the substrate surface. ### Claim 7 (depends on 5) The emitter according to claim 5, wherein a region of a cooling channel boundary surface of the at least one cooling channel which faces the respectively adjacent LED element extends away from the adjacent LED element with increasing distance from the substrate surface. ### Claim 8 (depends on 1) The emitter according to claim 1, wherein the at least one cooling channel is formed as a cavity in the encapsulation. ### Claim 9 (depends on 1) The emitter according to claim 1, wherein the encapsulation comprises at least one of the group comprising a silicone elastomer and a resin. ### Claim 10 (depends on 1) The emitter according to claim 1, wherein the encapsulation comprises at least one of the group comprising a silicone elastomer and an epoxy resin. ### Claim 11 (depends on 1) The emitter according to claim 1, wherein a cross-section of the at least one cooling channel is polygonal in shape. ### Claim 12 (depends on 1) The emitter according to claim 1, wherein a cross-section of the at least one cooling channel is triangular. ### Claim 13 (depends on 1) The emitter according to claim 1, wherein the at least one cooling channel has an extension perpendicular to the substrate surface of between 1 mm and 20 mm. ### Claim 14 (depends on 1) The emitter according to claim 1, wherein the at least one cooling channel has an extension perpendicular to the substrate surface of between 1 mm and 15 mm. ### Claim 15 (depends on 1) The emitter according to claim 1, wherein the at least one cooling channel contains a coolant comprising ethylene glycol. ### Claim 16 A method of emitting light by means of an emitter comprising the steps of: providing an emitter, comprising: a substrate with a substrate surface, at least one LED element arranged on the substrate surface for generating light to be emitted, and an active cooling unit for cooling the at least one LED element, with at least one cooling channel for a coolant, wherein the at least one cooling channel is arranged in a beam path of at least a portion of the light to be emitted which can be generated by means of the at least one LED element, generating the light to be emitted by means of the at least one LED element, cooling of the at least one LED element by means of the active cooling unit and redirecting at least a portion of the light to be emitted by means of the at least one cooling channel, wherein the redirection of the light to be emitted takes place without changing a frequency of the light to be emitted, wherein the at least one LED element and the at least one cooling channel are embedded in a transparent encapsulation, wherein a refractive index nE of the transparent encapsulation is greater than a refractive index nK of the cooling channel, and wherein a surface tangent of a region of a cooling channel boundary surface of the at least one cooling channel facing the at least one LED element runs at an angle d to the substrate surface, where the following applies: d≤90°−sin−1(nK/nE). ### Claim 17 (depends on 16) The method according to claim 16, wherein at least one portion of the light to be emitted is deflected by the at least one cooling channel in the direction of a predefined main emission direction. ### Claim 18 (depends on 16) The method according to claim 16, wherein at least one portion of the light to be emitted is deflected by the at least one cooling channel in the direction of a main emission direction defined to be perpendicular to the substrate surface. ### Claim 19 (depends on 16) The method according to claim 16, wherein the redirection of at least one portion of the light to be emitted takes place by reflection at a cooling channel boundary surface of the at least one cooling channel. ### Claim 20 (depends on 16) The method according to claim 16, wherein the redirection of at least one portion of the light to be emitted takes place by total reflection, at a cooling channel boundary surface of the at least one cooling channel.